Achieve Non-Destructive Failure Analysis with Tescan Micro-CT

Use high-resolution micro-CT to scan devices and components without disassembly. Visualize internal structures in real time with clear material contrast for confident analysis.

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Tescan solutions

for advanced research in semiconductors

Micro-CT for Electronics: Fast, Non-Destructive 3D Imaging

Use Tescan Micro-CT systems to perform non-destructive 3D visualization of consumer electronics, from full device to individual components.

Overcome Teardown Challenges with Micro-CT for Consumer Electronics Inspection
- Disassembly carries the risk of damaging fragile parts or changing the internal structure and may not provide true 3D context or enable access to components embedded deep inside.
Why Using Micro-CT for Non-Destructive Testing of Consumer Electronics Makes Sense
- Inspect full devices and zoom in to component-level defects
- Expose internal battery faults without breaking the seal
- Verify TSV alignment with submicron VOI scans
- Reveal hidden voids in BGA solder bumps
- Inspect wire bonds in microchips with high resolution

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Micro-CT for Semiconductors: Non-Destructive 3D Imaging of Thermally Induced Displacements in Packaging

Warpage is a critical reliability challenge in semiconductor packaging, often leading to defects such as delamination, die cracking, and misalignment. This application note shows how the Tescan UniTOM® HR enables in-situ micro-CT for non-destructive, full 3D quantification of thermally induced displacement, revealing internal deformation beyond the limits of surface-based techniques.

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visualisation_and analysis of thermally induced displacements_using_micro-CT

Tescan Solutions

for Consumer Electronics

Tescan UniTOM^® HR

Tescan UniTOM^® HR delivers high-resolution and dynamic micro-CT for component-level testing. Fast image processing and precision imaging make it ideal for small samples, while true 4D capabilities capture structural changes in real time.

True 4D dynamic CT: Provides sub-5-second temporal resolution
High spatial resolution: Resolves features below 600 nm
In-situ compatibility: Supports rotational stages, pressure setups, and powered devices

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Tescan UniTOM^® XL

Tescan UniTOM^® XL delivers versatile micro-CT inspection for full devices and large assemblies. A large scanning envelope and powerful X-ray source let you capture both fast overviews and detailed zooms in a single system.

Dual-scan capability: Delivers quick overviews and high-resolution detail in one workflow
Large-sample capacity: Accommodates devices up to 45 kg and 1000 mm wide
Adjustable geometry: Offers flexible source-to-detector distance for optimal resolution on large parts

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Tescan
Libušina třída 21
623 00 Brno
Czech Republic

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