Tescan AMBER X 2
Tescan AMBER X 2 combines plasma FIB milling with ultra-high-resolution SEM and integrated chemical analysis tools — ideal for studying electrode materials at every scale.
- Plasma FIB for fast lamella milling and volume sectioning
- Field-free UHR SEM with low-kV imaging for surface-sensitive features
- Integrated RSTEM for nanometer-scale subsurface analysis
- Compatible with inert sample transfer workflows






