Battery safety and lifespan depend on understanding how cells degrade under cycling, heat, and complex operating conditions. Failure mechanisms such as particle degradation, electrolyte dynamics, and internal delamination can reduce capacity and trigger safety risks.
Electrode particle degradation drives capacity fade and internal resistance growth. Tescan AMBER X 2 with ToF-SIMS and Raman spectroscopy enables full structural and chemical analysis of degradation processes.
As electronics become smaller and more integrated, ensuring internal quality without disassembly is increasingly essential. Tescan’s spectral micro-CT reveals internal defects and material inconsistencies in wearables and PCBs, non-destructively, in full 3D.
High-throughput FIB-SEM for large-volume electrode analysis and failure control.
Large-scale micro-CT for assembled battery inspection and geometry control.
