High-throughput, artifact-free cross-sectioning with continuous visibility of the milling front, enabling accurate end-pointing, faster 3D tomography, and pristine results even at high FIB beam currents.
The High beam currents offer fast milling, but in multiphase or multimaterial samples, they create severe curtaining and surface scratches; reducing the FIB beam current removes the artifacts but slows cross-sectioning and 3D tomography by 5–10×.
Tescan Rocking Stage solves this by enabling artifact-free FIB cross-sectioning and polishing at high beam currents, preserving speed while improving surface quality for failure analysis and advanced material characterization. By tilting the cross-section plane during milling, the Rocking Stage offsets curtaining caused by different sputtering rates, surface topography, and sample inhomogeneity.
At the same time, continuous SEM imaging provides live monitoring and precise end-pointing throughout the milling process. The design preserves full FIB-SEM versatility and is compatible with loadlocks, Beam Deceleration Mode (BDM), and the RSTEM detector, accommodating a variety of samples, including flat samples such as foils and rubber parts, as well as tall resin-embedded blocks.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
