Ga⁺ FIB column - Built for Materials Science Performance
The advanced Ga⁺ FIB column Orage™ 2 delivers enhanced speed, precision, and consistency in TEM lamella preparation and sample characterization for materials science applications.
Its improved beam current density enables up to 40% faster milling for TEM lamella preparation and cross-sectioning, allowing earlier access to material characterization. At the same time, clearer low-keV FIB imaging down to 500 eV provides excellent visibility during the final polishing step, ensuring precise beam placement and reliable preparation of high-quality, ultra-thin lamellae.
With Orage™ 2 integrated, the FIB-SEM Tescan AMBER 2 presents a robust and versatile platform for advanced materials science workflows, including TEM and APT sample preparation, and nanoprototyping. Together, AMBER 2 and Orage™ 2 enable fast, seamless, and fully automated workflow focused on achieving consistent, ultra-thin lamellae with minimal operator effort.
The TEM AutoPrep™ Pro software module manages the complete preparation process - from trench milling and lamella lift-out to final low-keV polishing - significantly reducing operator workload while maintaining full process control. During lift-out, Tescan’s OptiLift™ nanomanipulator enables secure attachment of a wide range of lamella geometries to the TEM grid in a few simple steps. For the final surface cleaning step, Tescan’s Aura™ Gentle Ion Beam provides low-keV Ar⁺ polishing to minimize amorphous damage and reduce Ga⁺ contamination, ensuring optimal sample quality for high-resolution analytical techniques.
Low keV performance
With market-leading FIB imaging quality down to 500 eV, Orage™ 2 gives you maximum visibility of the finest details of your lamella. This clarity enables confident cleaning of ultra-thin lamellae with negligible amorphization damage and makes precise beam placement easier, ensuring smooth completion of the final polishing steps during TEM sample preparation.
Up to 40% faster TEM lamella preparation
The improved spot profile at high beam currents allows lamella preparation to be completed up to 40% faster compared to conventional solutions. This improves efficiency across every lab, whether you’re a researcher or a quality control engineer.
Larger datasets within the same timeframe
The improved beam profile enables up to 4.5 hours of time reduction during large area cross-sectioning (>100 µm) while maintaining consistent sample quality. This allows users to acquire larger datasets within the same experimental timeframe, improving overall throughput and efficiency.
Reliable outcomes
Fully automated lamella preparation, combined with long-term column stability and a well-defined beam spot profile, ensures reliable FIB performance across multiple unattended runs and delivers consistent, reproducible results.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
