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Imaging Insulating Samples Without Compromise 

Tescan MultiVac 

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Designed for Precision Imaging in Challenging Conditions

Tescan MultiVac enables precise, charge-free imaging of insulating, beam-sensitive, and outgassing samples without the need for conductive coating. It operates in both nitrogen and water vapor atmospheres, offering extended variable pressure control up to 500 Pa for optimal charge compensation and enhanced topographic imaging when using water. The integrated gaseous secondary electron detector (GSD) delivers high-resolution topographic imaging at low keV and low beam currents. MultiVac is fully integrated with Tescan SEMs and controlled via Essence™ software, ensuring consistent performance and efficient workflows.

  • Supports low-vacuum imaging or analytical workflows of challenging samples without a conductive coating required.


  • Enables precise pressure control (up to 500 Pa) in N₂ and H₂O atmospheres for effective charge compensation.


  • Provides high-resolution topographic imaging at low keV using the GSD, ideal for beam-sensitive materials.


  • Uses water vapors to enhance the topographic contrast.


  • Seamlessly integrates with Tescan SEMs and Essence™ software for streamlined, high-quality imaging.

WHERE Tescan MULTIVAC MAKES THE DIFFERENCE

Automation Without Variability

Achieve consistent results across users and sessions with precise vacuum control and automated imaging routines.  

Minimal Beam Damage, Maximum Precision 

Low keV imaging with GSD preserves surface detail and reduces beam-induced artefacts. In combination with water vapors, it delivers enhanced topographic contrast and higher signal efficiency.

Reproducible Quality Across Challenging Samples

From uncoated insulators to outgassing materials, MultiVac delivers stable, high-resolution results.

Streamlined Workflows for Demanding Labs 

Essence™ software integration and compatibility with Optical Navigation simplify imaging across large or high-volume sample sets.

Advanced Performance

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AI-powered automated workflow

The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.

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Ultimate quality of TEM lamellae 

A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.

This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials. 

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Tescan Orage 2 APPLICATION EXAMPLES

 

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Tescan Nanomanipulator

Technical highlights
Compatible with all Tescan FIB-SEM systems

X, Y, and Z axis manipulation

Reliable in-situ TEM lamella lift-out

Smooth, low-vibration performance

Easy probe tip replacement using the removable arm

Compatible with all Tescan FIB-SEM systems

X, Y, and Z axis manipulation

Reliable in-situ TEM lamella lift-out

Smooth, low-vibration performance

Easy probe tip replacement using the removable arm

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GET IN Touch

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Where you can find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic



info@Tescan.com 

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