Automation Without Variability
Achieve consistent results across users and sessions with precise vacuum control and automated imaging routines.
WEBINAR | Correlated Microanalytical Workflows for Particle Analysis Using Automated Mineralogy, FIB-SEM and SIMS
Designed for Precision Imaging in Challenging Conditions
Tescan MultiVac enables precise, charge-free imaging of insulating, beam-sensitive, and outgassing samples without the need for conductive coating. It operates in both nitrogen and water vapor atmospheres, offering extended variable pressure control up to 500 Pa for optimal charge compensation and enhanced topographic imaging when using water. The integrated gaseous secondary electron detector (GSD) delivers high-resolution topographic imaging at low keV and low beam currents. MultiVac is fully integrated with Tescan SEMs and controlled via Essence™ software, ensuring consistent performance and efficient workflows.
Automation Without Variability
Achieve consistent results across users and sessions with precise vacuum control and automated imaging routines.
Minimal Beam Damage, Maximum Precision
Low keV imaging with GSD preserves surface detail and reduces beam-induced artefacts. In combination with water vapors, it delivers enhanced topographic contrast and higher signal efficiency.
Reproducible Quality Across Challenging Samples
From uncoated insulators to outgassing materials, MultiVac delivers stable, high-resolution results.
Streamlined Workflows for Demanding Labs
Essence™ software integration and compatibility with Optical Navigation simplify imaging across large or high-volume sample sets.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
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Compatible with all Tescan FIB-SEM systems
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X, Y, and Z axis manipulation |
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Reliable in-situ TEM lamella lift-out |
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Smooth, low-vibration performance |
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Easy probe tip replacement using the removable arm |
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Compatible with all Tescan FIB-SEM systems
|
|
X, Y, and Z axis manipulation |
|
Reliable in-situ TEM lamella lift-out |
|
Smooth, low-vibration performance |
|
Easy probe tip replacement using the removable arm |
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