Integrated EBL Workflow
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Perform EBL directly on a Tescan SEM and FIB-SEM systems.
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Use the EBL kit directly within the familiar Essence™ software GUI.
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Combine with FIB-based lithography for multipurpose nanoprototyping.
Beyond Conventional Materials Science: Design, Create and Analyse Next Generation Sensors and Devices
Tescan Essence™ EBL Kit
Dedicated software module for high precision electron beam nanopatterning for SEM and FIB-SEM
Electron beam lithography (EBL) uses a focused electron beam to draw patterns on a resist-coated surface (covered by an electron-sensitive film). It’s widely used for prototyping micro- and nanostructures with precise shapes, dimensions, and material compositions across various substrates, including sensors, photonics, plasmonics, spintronics, MEMS, microfluidics, and cell growth surfaces.
The Tescan Essence™ EBL Kit works with Tescan’s fast electrostatic beam blanker to deliver a fully integrated EBL solution on a standard SEM. When installed on a FIB-SEM, it enables combined electron and ion beam lithography for advanced research.
- Seamless SEM integration: The fully integrated Essence™ EBL software module works within the familiar Tescan Essence™ interface, so there’s no need for separate equipment or complex setup, just a smooth extension of your existing workflow.
- Designed for real-world research: Supports a wide range of applications, from photonics and NEMS/MEMS to microfluidics and cell growth surfaces.
- Precision without complexity: Z-leveling through beam refocusing, proximity error correction through fracture-free exposition for accurate and reproducible patterning.
- Efficient from design to exposure: Avoid field stitching errors and exposure defects by tailoring your EBL exposure strategy during multifield exposures.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
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with specialist
