Integrating Argon Ions with a Ga+ FIB SEM Is Essential for Modern (S)TEM Specimen Preparation
Enhancing Ga+ FIB-SEM Capabilities with Fully Integrated Low-Energy Argon Ion Beam Cleaning.
Tescan Aura™ Gentle Ion Beam (GIB)
Deliver the best-quality sub-50 nm TEM specimen every time. Fully integrated Ar Gentle ion Beam in your FIB-SEM.
Prepare ultra-thin S/TEM specimens with negligible damage every time, using low-energy (<300 eV) Ar⁺ polishing directly inside your Tescan AMBER™ or Tescan SOLARIS™ FIB-SEM. Minimize amorphization of your specimen down to 2 nm and assure Ar+ cleaned S/TEM specimen quality before it reaches High Resolution S/TEM.
Ultra-thin S/TEM specimens with negligible damage for reliable TEM/STEM analysis
A TEM lamella can be thin and still contain preparation damage. Ga implantation, redeposition, oxidation, or amorphous layers affect high-resolution TEM/STEM results. When your analysis depends on layers interfaces, nanoscale precipitates or crystalline structures, final specimen quality is determined primarily by how much of the specimen interior remains unaffected by preparation, not by thickness alone.
Low-energy Ar⁺ finishing inside the FIB-SEM
Tescan Aura™ Gentle Ion Beam adds integrated low-energy argon S/TEM specimen final cleaning into Tescan AMBER™ and Tescan SOLARIS™ FIB-SEMs. The specimen stays in the microscope chamber, the process is controlled through the FIB-SEM software, and STEM-in-SEM inspection supports quality endpointing before final TEM/STEM analysis.
In one glance
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Pristine S/TEM specimen surfaces: Minimize amorphization, intermixing, surface contamination, oxidation, and Ga-implanted zones with gentle Ar⁺ polishing on your FIB-SEM.
- Unified FIB-SEM and Ar+ Gentle Ion Beam cleaning Workflow: Avoid unnecessary transfers to a separate argon mill and reduce the risk of specimen degradation, contamination, misalignment, or loss.
- User independent, reproducible final S/TEM specimen cleaning: Use recipe-based, GIB processing after fully automated TEM preparation to make high-quality S/TEM specimen preparation accessible across all users in your lab.
Discover related webinars, articles, and technical insights
Perfecting TEM Lamella Preparation with AMBER™ 2 & Aura™
Learn how Tescan AMBER™ 2 and Aura™ Gentle Ion Beam enable automated, high-quality TEM lamella preparation with improved consistency and reduced damage.
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Non-destructive spectral imaging for material verification and internal inspection of advanced electronic assemblies.
TrueContrast™ multi-energy imaging for differentiating polymers, metals, and encapsulants
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K-edge detection for accurate identification of high-Z elements
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Non-destructive visualization of interfaces and buried defects in electronic packages
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Elemental mapping for identifying fillers, dopants, or additives in polymer composites
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Spectral contrast for distinguishing polymers, ceramics, and metals with similar densities
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Non-destructive 3D analysis of internal interfaces and phase boundaries
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Integrated Spectral Suite for correlating elemental and structural data in one workflow
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INTEGRATION THAT DRIVES INSIGHT
Tescan Spectral CT works seamlessly with SPECTRAL Suite and Acquila™ micro-CT control software to streamline spectral imaging from acquisition to analysis. Used as an add-on with the UniTOM XL platform, users can target volumes of interest, capture full-spectrum data, and visualize structural and elemental information in one workflow.
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