WEBINAR |  FemtoChisel™: Redefining Ultrafast Laser Processing


Tescan history

More than three decades ago, Tescan started with a simple ambition: build tools that help scientists see further. From a small beginning, we’ve grown into a global partner for researchers pushing discovery forward.

Tescan: Built on Curiosity. Grown Through Impact.

Founded with a drive to see further and understand more, TESCAN began by advancing the possibilities of electron microscopy. From our origins in Brno, Czech Republic—a globally respected center of electron optics—we’ve grown into a worldwide partner for science and industry. Today, our SEM, FIB-SEM, micro-CT, and STEM solutions support researchers and engineers across Europe, North America, Asia, and beyond, helping turn complex questions into clear insight.

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Our story

1991

From Tesla to Tescan

Tescan was born in Brno, Czech Republic, where a legacy of electron optics was already part of the city’s DNA. Founded by former engineers from the Tesla factories (one of the world’s first leading electron microscope hubs), the mission was simple but ambitious. Build world-class imaging systems that were easier to use and more accessible to the researchers who needed them most. 

Early innovations like PROXIMA (our integrated optical navigation system) and the VEGA variable pressure SEM set a tone we have kept ever since - practical, intuitive, and driven by real research needs. 
At the same time, Orsay Physics was doing something similar in France. Since 1989, they had been pushing the boundaries of focused ion beam (FIB) technology, developing custom solutions for microelectronics and materials science. Like Tescan, they believed tools should fit the people using them and they knew real innovation happens at the intersection of science and usability.

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2009

The gate to east

Tescan is stepping into the Chinese market and establishing Tescan China.

2013

The Merger  

After two decades on parallel paths, Tescan and Orsay came together to form Tescan Orsay Holding. This was more than a merger; it was a meeting of minds. . Tescan brought SEM systems known for their flexibility and ease of use, while Orsay contributed FIB expertise and precision engineering. Together, this team could offer integrated platforms across SEM, FIB-SEM, and microanalysis, united by a shared philosophy: make the complex feel simple.

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2015

Growing the Toolkit  

As our capabilities expanded, so did our team. The acquisition of XRE brought micro-CT to our portfolio, establishing Tescan micro-CT in Ghent. The integration of AppFive, now Tescan Tempe, added advanced system control and software innovation. These were also more than acquisitions, creating partnerships built on complementary strengths. Each one made our solutions broader, stronger, and better aligned with the needs of modern research.

During the same period, we expanded our global footprint by establishing Tescan Germany and Tescan Brazil, strengthening our presence in Europe and South America. 

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2022

A New Chapter for Growth and Innovation 

In 2022, Tescan achieved two major milestones that shaped its future direction. The launch of Tescan TENSOR™, the first 4D-STEM system developed from the ground up for a new level of performance and user experience, reinforced the company’s reputation for innovation in advanced analytical instrumentation. Later that year, global investment firm Carlyle agreed to acquire a majority stake in Tescan, signaling strong confidence in the company’s technology, global position, and long-term growth potential. Together, these milestones marked an important step in Tescan’s evolution, combining breakthrough innovation with strategic backing for further expansion.

 

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Tescan Tensor

Tescan Tensor™

Tescan TENSOR™ delivers fast, multimodal characterization of nanoscale morphological, chemical, and structural properties. It uses STEM imaging, EDS analysis, and advanced 4D-STEM as well as 3D-ED and STEM/EDS tomography workflows. 

2023

Simplifying Structure, Expanding Focus

In 2023, Tescan simplified its corporate structure by merging Tescan Orsay Holding, Tescan Brno, and two dormant entities into Tescan Group. The move followed earlier shareholder changes and supported more efficient operations, closer alignment across the group, and long-term sustainable growth.
 
The year also marked continued progress in technology and market focus. Tescan introduced a new generation of Tescan CLARA™ 2, designed to improve automation, usability, and time to data for demanding workflows in materials science and battery research. At the same time, Tescan increased its focus on advanced packaging and batteries as important application areas for future growth. 


Tescan TENSOR™ received an R&D 100 Award in the Analytical/Test category, marking Tescan’s second consecutive R&D 100 recognition after Tescan UniTOM® HR.

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Tescan CLARA™ 

Tescan CLARA™ gives you sub-nanometer resolution with BrightBeam™ optics and flexible detection options. Designed for delicate and non-conductive samples, it supports multimodal workflows and in-situ experiments with strong contrast at low keV.

2024

Driving Innovation in Microscopy Workflows

In 2024, Tescan continued to expand its capabilities in advanced microscopy and workflow integration. The company introduced Tescan AMBER™ 2 and Tescan AMBER X™ 2, broadening its next-generation FIB-SEM portfolio for demanding materials science and semiconductor applications. Tescan also launched TEM AutoPrep Pro software, introduced ion beam integration, and expanded its portfolio with Aura™ Gentle, supporting more controlled and reliable sample preparation workflows. In the same year, Tescan strengthened its international presence with Tescan Korea, marking another step in the company’s global growth. 

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Tescan AMBER X™ 2

Tescan AMBER X™ 2 gives you Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM to handle both large-volume sectioning and delicate TEM lamella prep. Support multimodal workflows—including EDS, EBSD, ToF-SIMS, and Raman—across hard, soft, or beam-sensitive materials.

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Tescan AMBER™ 2

Tescan AMBER™ 2 gives you BrightBeam™ field-free SEM optics, the Orage™ Ga⁺ FIB, and fully automated lamella workflows for consistent, high-quality TEM sample preparation. Perform inverted and planar sample prep, nanoprocessing, and gentle final polishing across a wide range of materials.

2025

Expanding Our Global Reach

In 2025, Tescan achieved several important milestones that strengthened our technology portfolio and global market presence. The acquisition of EXpressLO LLC enhanced our specimen preparation and handling capabilities, especially in advanced FIB lift-out, cryogenic applications, and environmentally sensitive workflows. We also expanded our semiconductor solutions portfolio with the introduction of Tescan FemtoChisel™, a next-generation femtosecond laser platform delivering faster, more precise, and more reproducible sample preparation. Complementing these developments, we unveiled a new brand identity that reflects Tescan’s continued evolution and ambition as a global innovator in scientific instrumentation.

At the same time, our growth in the Asia-Pacific region accelerated through the acquisition of Tescan Korea and DML, longtime collaborators with a strong presence in the Korean semiconductor and academic sectors. Their integration brought more than 500 installed systems and decades of market experience under one roof, further solidifying our leadership in the region. That momentum continued with the launch of new subsidiaries in Taiwan and Singapore, bringing us closer to customers, strengthening long-term partnerships, and supporting the next generation of research and innovation across Asia.

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Tescan FemtoChisel™

Tescan FemtoChisel is the next-generation femtosecond laser solution built specifically for semiconductor sample preparation and failure analysis. For too long, the industry has had to compromise between throughput, precision, and Surface Quality. Now all are delivered on one integrated platform.  

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Tescan EXLO™

Tescan EXLO™ is a high-precision ex situ lift-out system that increases throughput and reduces both TEM costs and FIB-SEM load. External specimen handling enables parallel processing and higher prep efficiency. Its motorized, semi-automated design ensures fast, reproducible lift-outs while freeing the FIB-SEM for priority tasks. Improve TEM prep efficiency with consistent, reliable lift-outs.

Today

Global, Focused, and Still Inventing

Tescan now spans four R&D centers - in Brno, Fuveau, Ghent and Tempe - with nearly 1,000 people working across 80+ countries. We offer one of the widest imaging portfolios on the market, from SEM and micro-CT to plasma FIB-SEM and beyond. With the acquisition of ExpressLO’s patents, we are creating new possibilities in signal detection, and opening doors to faster, clearer, smarter results. 

We have come a long way from that team of engineers in Brno. But the goal hasn’t changed: build imaging systems that remove friction, empower discovery, and move science forward.