Powered by Tescan’s proprietary technology, FemtoChisel combines true femtosecond precision machining with multi-wavelength selectivity, Intelligent Multi-Gas Processing, multi-modal correlative machine vision, advanced laser energy modulation in time and space, and in situ ablation monitoring. The result is pristine, analysis-ready cross-sections delivered at high throughput, without the debris, redeposition, or heat-affected zones traditionally associated with laser processing.
In this webinar, we will explore the unique capabilities that position FemtoChisel as a breakthrough platform for next-generation microelectronics inspection and advanced materials processing. Through real-world examples, we will demonstrate how FemtoChisel enhances and accelerates previously challenging workflows.
Applications to be discussed include large-area cross-sectioning, advanced sample preparation, internal device targeted access, micro- and nanofabrication, and intelligent delayering of complex heterogeneous material stacks.
Participants will also have a rare opportunity to see FemtoChisel in action on a real-world device, from sample mounting and intelligent targeting through the software interface and final inspection of results. Each step of the workflow will demonstrate how speed, quality, and precision converge in a single, integrated system.
This webinar is organized in collaboration with ASM International, a global leader in materials information, education, and professional development. Through this partnership, we bring together industry expertise and advanced technology to support the materials and semiconductor communities with practical, high-impact insights.
Join us to discover how FemtoChisel™ is redefining ultrafast laser processing for advanced semiconductor inspection and materials workflows. This session will include real-world demonstrations and live insights from Tescan experts.

Reserve your place today and gain direct access to our specialists during the live Q&A session. Registration is free, but spaces may be limited.