Bridging the Gap in Semiconductor Failure Analysis
In the fast-paced semiconductor industry, the "time-to-data" bottleneck often lies in the transition from defect localization to high-resolution analysis. Traditional sample preparation can be slow, messy, and prone to heat damage - until now.
Watch this on-demand webinar to discover Tescan FemtoChisel™, a precision-engineered, intelligent laser nanomachining system designed to revolutionize your failure analysis (FA) and advanced packaging workflows.
Join Sina Shahbaz Mohammadi (Head of Technology, Laser Business Unit) and Dr. Nicholas May (Head of Applications) as they demonstrate how FemtoChisel™ acts as the missing link in a multi-modal microscopy ecosystem.
Integrated Workflows: How to bridge the gap between Micro-CT, FIB-SEM, and TEM to create a seamless path from large-area inspection to atomic-level characterization.
Beyond Standard Lasers: Discover why intelligent multi-gas processing and laser protective layers eliminate debris and heat-affected zones (HAZ).
Precision Engineering: A deep dive into real-time 3D monitoring, machine vision targeting, and the software-selectable multi-wavelength (IR/Green) laser source.
Live Application Demo: See FemtoChisel™ in action performing large-area cross-sectioning on microelectronics, featuring a look at the intuitive software and system interior.
The FemtoChisel™ is specifically designed to handle the "heavy lifting" of material removal, allowing your high-resolution tools to stay focused on what they do best:
Locate: Identify defects non-destructively with Micro-CT.
Access: Use FemtoChisel™ for ultra-fast, targeted bulk milling to reach the Region of Interest (ROI).
Analyze: Perform final high-precision cross-sectioning and imaging with FIB-SEM.
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Feature |
Benefit to Semiconductor Labs |
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Intelligent Multi-Gas |
Dramatically reduces redeposition for cleaner surfaces. |
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Confocal Height Sensor |
Real-time 3D monitoring of the milling process. |
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300mm X-Y Stage |
High degrees of freedom (Rotation/Tilt) for full-wafer accessibility. |
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Dual-Wavelength Path |
Seamlessly switch between IR and Green lasers for material-specific optimization. |
This webinar was proudly organized and streamed by ASM International. 
Laser Technologies Business Unit, Tescan
Professor Shahbazmohamadi focuses on translating advanced engineering developments into practical solutions for semiconductor and materials science applications. With a strong background in high-precision processing technologies and product strategy, Sina works at the intersection of innovation, application development, and customer workflows.
Tescan
Nicholas leads Applications & Operations at Tescan, where he oversees global application development, customer workflows, and advanced process integration across semiconductor and materials science technologies. With extensive experience in high-precision sample preparation and analytical instrumentation, he works closely with research and industrial teams to translate complex technical challenges into practical, high-performance solutions.