CAM Workshop - Failure Analysis and Material Diagnostics of Electronic Components      

About the Event

The workshop addresses analytical methods used in semiconductor failure analysis and diagnostics of electronic components. Key topics include defect localization, materials characterization, and process validation in advanced packaging and chip-level integration.

It provides a technical platform for discussing how microscopy, sample preparation, and cross-sectioning workflows support reliability and yield improvement in microelectronics.

Tescan at the Event

Tescan participates as a co-organizer, with a focus on semiconductor analysis workflows and high-throughput sample preparation.

At the workshop, Tescan presents:

• FemtoChisel-based workflows for decapsulation, delayering, and large-area cross-sectioning

• Semiconductor-focused solutions combining FIB-SEM and micro-CT for destructive and non-destructive analysis

Featured Technologies:

• Tescan Femto – laser-assisted sample preparation for fast, precise material removal

• FIB-SEM workflows – site-specific cross-sectioning and defect analysis

• Micro-CT (m-CT) – non-destructive inspection of packaged devices and internal structures

These approaches support efficient failure analysis, especially in complex semiconductor devices and advanced packaging architectures. 

Agenda / Programme

19 May 2026 | Tescan FemtoChisel: High-Throughput Decapsulation, Delayering, and Large-Area Cross-Sectioning for Advanced Microelectronics

Speaker: Pouya Tavousi, Head of AI and Advanced Solutions, Tescan Group

What You Will Learn

• How laser-assisted decapsulation improves throughput in semiconductor failure analysis

• Efficient delayering techniques for multilayer chip structures

• Large-area cross-sectioning methods for advanced packaging

• When to combine FIB-SEM with micro-CT for complete device insight

• Practical workflows for defect localization and root cause analysis

Who Should Attend

• Semiconductor failure analysis engineers

• Experts in advanced packaging and chip integration

• Materials scientists working on electronic components

• Engineers focused on reliability, yield, and diagnostics

• Labs performing microelectronics characterization

Why Attend

This workshop is relevant for teams working on real-world semiconductor reliability challenges. It focuses on practical methods for analyzing complex devices, where throughput, precision, and data quality directly impact development and production.

FAQs