About the Event
The workshop addresses analytical methods used in semiconductor failure analysis and diagnostics of electronic components. Key topics include defect localization, materials characterization, and process validation in advanced packaging and chip-level integration.
It provides a technical platform for discussing how microscopy, sample preparation, and cross-sectioning workflows support reliability and yield improvement in microelectronics.
Tescan at the Event
Tescan participates as a co-organizer, with a focus on semiconductor analysis workflows and high-throughput sample preparation.
At the workshop, Tescan presents:
Featured Technologies:
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Tescan Femto – laser-assisted sample preparation for fast, precise material removal
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FIB-SEM workflows – site-specific cross-sectioning and defect analysis
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Micro-CT (m-CT) – non-destructive inspection of packaged devices and internal structures
These approaches support efficient failure analysis, especially in complex semiconductor devices and advanced packaging architectures.
Agenda / Programme
19 May 2026 | Tescan FemtoChisel: High-Throughput Decapsulation, Delayering, and Large-Area Cross-Sectioning for Advanced Microelectronics
Speaker: Pouya Tavousi, Head of AI and Advanced Solutions, Tescan Group
What You Will Learn
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How laser-assisted decapsulation improves throughput in semiconductor failure analysis
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Efficient delayering techniques for multilayer chip structures
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Large-area cross-sectioning methods for advanced packaging
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When to combine FIB-SEM with micro-CT for complete device insight
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Practical workflows for defect localization and root cause analysis
Who Should Attend
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Semiconductor failure analysis engineers
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Experts in advanced packaging and chip integration
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Materials scientists working on electronic components
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Engineers focused on reliability, yield, and diagnostics
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Labs performing microelectronics characterization
Why Attend
This workshop is relevant for teams working on real-world semiconductor reliability challenges. It focuses on practical methods for analyzing complex devices, where throughput, precision, and data quality directly impact development and production.
Registration
Registration is available via the official event website:
Tescan will be available on-site for technical discussions. Meetings can be arranged during the workshop.
FAQs
What is Tescan presenting at the CAM Workshop?
Tescan presents a FemtoChisel-based workflow for high-throughput decapsulation, delayering, and cross-sectioning in semiconductor devices.
How is Femto used in semiconductor failure analysis?
Femto enables fast material removal using laser-assisted processing, making it suitable for preparing large cross-sections and accessing internal chip structures efficiently.
Which techniques are used for electronic component diagnostics?
Typical workflows combine laser-assisted preparation (Femto), FIB-SEM cross-sectioning, and micro-CT for non-destructive inspection and defect analysis.
Who should attend this workshop?
Engineers and researchers involved in semiconductor failure analysis, advanced packaging, and materials diagnostics.
