WEBINAR |  Improved TEM Specimen Quality and Lab Throughput with New AMBER 2 Ga⁺  FIB-SEM 

What this webinar is about

High-quality TEM specimen preparation is essential for reliable nanoscale materials characterization. However, curtaining artifacts, inconsistent lamella thickness, FIB-induced damage, and time-consuming parameter optimization often limit reproducibility and slow analytical workflows.

This webinar introduces an integrated solution combining the Orage™ 2 Ga⁺ FIB column and Aura™ Gentle Ion Beam within the Tescan AMBER 2 platform. By enhancing beam stability, optimizing beam profiles, and enabling low-energy Argon polishing down to 200 eV, this approach supports cleaner milling, controlled damage removal, and consistent, lattice-quality specimens, accelerating time to reliable S/TEM data. 

What you will learn by watching

• How enhanced Ga⁺ beam parameters improve cross-section quality and lamella consistency 

• How low-energy Argon polishing refines specimen surfaces while preserving nanoscale structural integrity 

• How integrated workflows improve reproducibility and reduce variability in TEM specimen preparation

• How AI automation and full process control increase lab throughput

Who should attend

This webinar is designed for:  

• Researchers in materials science, experts in advanced materials characterization 
  

• Electron microscopy specialists working with TEM, S/TEM, and FIB-SEM 

• Scientists are seeking improved reproducibility and structural fidelity at the nanoscale. 

Register to join this technical session and learn how integrated Ga⁺ FIB and low-keV polishing workflows on AMBER 2 improve TEM specimen quality, reproducibility, and lab throughput.