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Tescan MIRA XR for Materials Science

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Achieve consistent, ultra-high-resolution imaging and fast EDS analysis across diverse materials with Tescan MIRA XR. Gain reliable results through advanced beam stability, intelligent automation, and adaptable vacuum modes to make every workflow precise, efficient, and easy to manage.

  • BrightBeam™ technology for nanometer-scale details
  • In-Flight Beam Tracing™ for optimized, repeatable imaging
  • Wide Field Optics™ for effortless navigation across scales
  • Dual Essence™ EDS for fast, accurate chemical analysis
  • MultiVac™ mode for reliable imaging of challenging samples
  • VisualCoder™ automation to cut operator workload by up to 80%

Main Benefits of TESCAN MIRA XR

for Materials Science Workflows

Reproducible Nanometer-Scale Imaging

Achieve consistent, ultra-high-resolution results across users and sessions with BrightBeam™ technology and In-Flight Beam Tracing™, ensuring stable beam conditions and repeatable imaging quality.  

Confident Imaging of Challenging Samples

Capture reliable images of charging, porous, or beam-sensitive materials in MultiVac™ low-vacuum mode. No coating is required.  

Fast, Accurate Chemical Mapping

Double your EDS throughput with Dual Essence™ EDS, providing precise multi-element maps and reduced shading for efficient compositional analysis.

Streamlined and Automated Workflows 

Simplify complex imaging tasks with VisualCoder™ automation, allowing intuitive drag-and-drop workflow creation that reduces operator time by up to 80%.  

Effortless Navigation Across Scales

Move seamlessly from large-area overviews to nanoscale details with Wide Field Optics™, accelerating orientation and reducing time-to-data.  

EBSD-Ready Crystallographic Analysis 

Combine large-area and nanoscale EBSD mapping in one workflow, supported by Tescan MIRA XR’s stable beam conditions and wide analytical chamber for comprehensive crystallographic studies. 

TESCAN MIRA XR

in materials science
03_Analytical points and line profile laid across the garnet-2

Simplify SEM-EDS Petrological Analysis of Complex Rock Samples

Use Tescan SEMs with Dual Essence™ EDS to perform integrated SEM-EDS analysis that resolves zonation and overlapping phases in complex geological samples.

See application
01_Image of homogeneous nanofibrous mesh after process parameters optimization-Nov-26-2025-12-46-28-1797-PM

High-Resolution SEM for Quality Assessment of Electrospun Nanofibers

Tescan MIRA XR enables non-destructive imaging of fiber morphology and diameter across polymer meshes.

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03_Detailed ultra-high resolution image of mesoporous silica SBA-15 using Axial detector at 800 eV using Beam Deceleration-1

Morphology of Mesoporous Silica Revealed by Low-kV SEM Imaging

Tescan MIRA XR provides high-resolution insight into SBA-15 particle shape and structure.

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Essence™ Image Snapper

AUTOMATED IMAGE ACQUISITION FOR REPRODUCIBLE MATERIALS ANALYSIS

Essence™ Image Snapper automates image collection across multiple regions of interest, ensuring every dataset is captured under consistent, optimized conditions. Integrated into the Essence™ environment, it reduces operator input and speeds up data acquisition for morphology, composition, and defect analysis.

With unattended batch routines, Image Snapper delivers reproducible, high-quality SEM images for standardized materials research and quality control.

It also supports panorama creation, automatically stitching images into seamless large-area overviews. This is ideal for studying microstructural uniformity and contextualizing nanoscale features within broader sample regions.

Essence_Image_Snapper_(1)
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Why Choose TESCAN MIRA XR

for Materials Science

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TESCAN MIRA XR for Materials Science

Technical specification
TESCAN MIRA XR® UHR SEM-EDS for Materials Science
Specifications shown are based on the GM chamber configuration.

Ultra-high resolution BrightBeam™ FE-SEM column

Resolution:
• 0.8 nm @ 30 keV (STEM detector)
• 1.0 nm @ 15 keV
• 1.5 nm @ 1 keV
• 1.4 nm with sample bias (BDT)
• 1.7 nm @ 500 eV

Magnification range from 1× to 2,000,000×

Essence™ integration for SEM and EDS in one interface

Elemental mapping, line scans, and point analysis included

Wide Field Optics™ for SEM navigation from 1×

Essence™ 3D Collision Model for chamber visualization and protection

MultiVac low vacuum imaging up to 500 Pa

5-axis motorized stage with max sample size of 335 × 280 × 133 mm³ and load capacity up to 8 kg

20+ chamber ports ready for detector upgrades
Included & Optional Accessories

Dual Essence™ EDS detectors for high-speed mapping

In-Column Axial detector for high-efficiency ultra-high resolution imaging

EBSD detector for crystallographic analysis from large maps to nanoscale

STEM detector for transmission imaging at sub-nanometer resolution

VisualCoder™ and SEM Expert PI for workflow automation and customization

VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting
TESCAN MIRA XR® UHR SEM-EDS for Materials Science
Specifications shown are based on the GM chamber configuration.

Ultra-high resolution BrightBeam™ FE-SEM column

Resolution:
• 0.8 nm @ 30 keV (STEM detector)
• 1.0 nm @ 15 keV
• 1.5 nm @ 1 keV
• 1.4 nm with sample bias (BDT)
• 1.7 nm @ 500 eV

Magnification range from 1× to 2,000,000×

Essence™ integration for SEM and EDS in one interface

Elemental mapping, line scans, and point analysis included

Wide Field Optics™ for SEM navigation from 1×

Essence™ 3D Collision Model for chamber visualization and protection

MultiVac low vacuum imaging up to 500 Pa

5-axis motorized stage with max sample size of 335 × 280 × 133 mm³ and load capacity up to 8 kg

20+ chamber ports ready for detector upgrades

Included & Optional Accessories

Dual Essence™ EDS detectors for high-speed mapping

In-Column Axial detector for high-efficiency ultra-high resolution imaging

EBSD detector for crystallographic analysis from large maps to nanoscale

STEM detector for transmission imaging at sub-nanometer resolution

VisualCoder™ and SEM Expert PI for workflow automation and customization

VisualCoder for workflow automation and SEM Expert PI for advanced automation and scripting

MIRA XR GM MONO Metal (3)

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Where can you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.479653 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928 -12.08688

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