In TEM/STEM analysis of aluminum alloys, the structures of interest can span a wide range of sizes, making it essential to preserve both larger features and the finest nanoscale details within the lamella. However, these nanoscale features can be obscured by surface damage, amorphization, uneven thickness, or Ga⁺ contamination introduced during conventional Ga⁺ FIB preparation.
Additional low-energy FIB polishing may reduce some damage but still relies on Ga⁺ ions and remains sensitive to operator skill and endpoint control, while standalone Ar⁺ polishing adds extra transfer steps, handling risks, and workflow complexity.
Discover how Tescan AURA™ Gentle Ion Beam, fully integrated into the FIB-SEM, enables low-energy Ar⁺ final polishing followed by direct in-chamber quality inspection within a single workflow. This helps reduce Ga⁺-related surface damage, reveal fine precipitates, verify lamella readiness without additional transfers, and support more repeatable TEM sample preparation.
