Ripple-free plasma FIB cross-sectioning without sacrificing speed or beam current
Tescan TRUE X-Sectioning is a time-saving method for producing high-quality, ripple-free plasma FIB cross-sections, especially when working at large scales. When preparing cross-sections in the 100 µm to 1 mm range, traditional Pt deposition often becomes a major bottleneck: the protective layer must cover a wide and often uneven surface, requiring long deposition times and a thicker Pt cap to make the large topographic area more homogeneous. Even then, beam-induced rippling often persists, forcing users to drop the beam current and significantly extend milling times.
TRUE X removes this limitation by replacing slower in-situ deposition with pre-cut monocrystalline silicon masks that can be positioned and attached to the sample surface using the Tescan Nanomanipulator. These Si masks provide a perfectly stable, uniform protective layer that tolerates even the highest plasma FIB beam currents, enabling fast, ripple-free milling on hard, composite, and resin-embedded samples. A guided workflow in Tescan Essence™ assists with mask selection, placement, and attachment - ensuring consistent, high-quality cross-sections with minimal operator effort.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
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