Integrated workflow control
Operates directly within the Tescan Essence™ GUI, providing the convenience of a single software environment.
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Purpose-built nanomanipulator for repeatable TEM/STEM and APT lift-out
The Tescan Nanomanipulator is fully compatible with all Tescan FIB-SEM systems, enabling fast and easy lift-out and manipulation of TEM/STEM and APT samples as well as FIB prototyped structures requiring lift out. Designed for smooth, predictable movement along every axis, it delivers the precision and stability required for reliable in-situ sample handling.
Unlike third-party probe systems that require separate software, the Tescan Nanomanipulator operates directly within the Tescan Essence™ GUI. This integration allows users to maintain workflow continuity and full control without leaving the microscope interface.
Integrated workflow control
Operates directly within the Tescan Essence™ GUI, providing the convenience of a single software environment.
Predefined manipulator positions
Improves throughput with quick transitions between parking, standby, and working positions.
Mouse gesture navigation
Enables intuitive control and precise probe tip placement at any desired point on the sample by in-window live control.
Removable arm for easy and fast nanomanipulators needle exchange
Allows simple probe tip exchange outside the chamber without special tools.
End-to-end Tescan hardware support
Provides unified service, application, compatibility, and accountability for entire TEM specimen preparation workflow.
AI-powered automated workflow
The AI-driven automated lamella preparation reduces human error, shortens training time, and enables reliable unattended operation. The automation is realized through the TEM AutoPrep™ Pro software module and the OptiLift™ nanomanipulator, forming a fully integrated system that delivers fast lamella preparation while ensuring consistent quality.
Ultimate quality of TEM lamellae
A fully integrated Aura™ Gentle Ion Beam enables precise final polishing and gentle low-keV Ar⁺ cleaning of TEM lamellae directly inside the AMBER 2 FIB-SEM, minimizing amorphous damage and surface Ga+ contamination.
This built-in solution provides direct, real-time control over the polishing process, ensuring the highest sample quality and optimal results in TEM lamellae preparation, even for the most challenging materials.
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Compatible with all Tescan FIB-SEM systems
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X, Y, and Z axis manipulation |
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Reliable in-situ TEM lamella lift-out |
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Smooth, low-vibration performance |
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Easy probe tip replacement using the removable arm |
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Compatible with all Tescan FIB-SEM systems
|
|
X, Y, and Z axis manipulation |
|
Reliable in-situ TEM lamella lift-out |
|
Smooth, low-vibration performance |
|
Easy probe tip replacement using the removable arm |
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