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See Where Tescan Is Making Headlines

Get a closer look at what’s happening at Tescan through the latest news, media coverage, and stories from across our global community.

Press releases

March 19, 2026

Tescan opens new Korea demo lab supporting semiconductor analysis

Tescan offers on‑site demos in a new scanning electron microscopy lab in Korea, supporting the semiconductor industry, research institutions and universities with FIB‑SEM expertise.

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PRESS RELEASE
Tescan Opens New Demo Lab in Korea to Support Semiconductor Failure Analysis, Reliability, and Academic Research
January 5, 2026
PRESS RELEASE

Tescan Announces Carlyle Agreement with Shimadzu Corporation

Carlyle and other shareholders have entered into an agreement with Shimadzu Corporation that may result in a change in Tescan’s shareholding structure, subject to approvals.

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November 18, 2025
PRESS RELEASE

Tescan Expands Semiconductor Workflows with FemtoChisel Laser Technology

Tescan introduces the FemtoChisel femtosecond laser platform, delivering faster, more precise semiconductor sample preparation and integrated workflow performance.

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September 16, 2025
PRESS RELEASE

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

Interview with Jean-Charles Chen, CEO of Tescan Group: Unveiling a New Era of Discovery

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IN THE News

Interview

Interview | How Electron Microscopy Reveals Material History | Tescan MIRA XR

Discover how researchers at the University of Žilina use electron microscopy and Tescan MIRA XR to study metallic materials, fractography, structural changes, and industrial failures

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Blog

How Does a Scanning Electron Microscope Work? | SEM Explained

Learn how a scanning electron microscope (SEM) works using the simple analogy of the Battleship game. Explore SEM signals, raster scanning, and FIB-SEM workflows.

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Blog

Integrated 4D-STEM Detector for SEM & FIB-SEM | Tescan

Discover how Tescan’s integrated retractable 4D-STEM detector enables diffraction-based analysis directly in SEM and FIB-SEM workflows for advanced materials characterization.

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Blog

Micro-CT to FIB-SEM Failure Analysis Workflow | Advanced Packaging

Discover how Micro-CT, ultrafast laser processing, and FIB-SEM create a faster, more reliable failure analysis workflow for advanced semiconductor packaging.

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Your contact

Jana Silarova

Marketing Director

+420 778 788 844

jana.silarova@tescan.com 

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Tescan Brno
Libušina třída 21
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