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UK & I FIB ToF-SIMS Network Workshop    

Join the UK & I FIB ToF-SIMS Network for a one-day, in-person workshop at Cranfield University on 27 April 2026, co-organised by Cranfield University and Tescan in UK. The day combines short presentations covering technology, theory, and practical applications of FIB-based ToF-SIMS, followed by an afternoon of hands-on sessions using a live FIB ToF-SIMS system. You’ll also get guided support on data processing software and practical help solving real data challenges. 

Apr 27, 2026

Why attend 

  • Learn the fundamentals and best practices of FIB ToF-SIMS and ToF-SIMS on FIB-SEM

  • See how 3D ToF-SIMS tomography supports advanced materials and failure analysis workflows

  • Get practical guidance on data processing and common interpretation challenges

  • Network with researchers and technical specialists from instrument manufacturers, academia, and industry

  • Lunch and refreshments included

Agenda overview

Morning: Talks and case studies  

  • Technology overview: FIB-based ToF-SIMS and integrated workflows

  • Theory and practical applications (materials, interfaces, and complex samples) 

Afternoon: Live, hands-on sessions 

  • Live FIB ToF-SIMS demonstrations

  • Data processing walk-through (software guidance)

  • Data problem-solving clinic (bring questions and examples)

Tescan will support the workshop with expert-led talks and live demonstrations focusing on ToF-SIMS integrated on FIB-SEM, 3D ToF-SIMS tomography, and related UHV FIB-SEM platform capabilities.

Secure your place at the UK & I FIB ToF-SIMS Network Workshop by completing the form below.
This one-day event brings together presentations and hands-on experience with live FIB ToF-SIMS, offering practical insight into both the technology and real-world applications. 

About Speakers

Tomas Samoril-1
Tomáš Šamořil

Dr. Tomáš Šamořil is Product Marketing Manager for Materials Science at Tescan, specialising in electron microscopy and advanced materials analysis. His work focuses on analytical FIB-SEM and integrated ToF-SIMS workflows, with particular experience in battery research and complex material characterisation. 

Jeremie-Silvent
Jeremie Silvent

Jeremie Silvent leads product sales activities across NSR, Nanospace, ion beam (IB), and UHV platforms at Tescan. He supports advanced FIB-SEM and integrated analytical solutions, working closely with research and industry partners to align instrument capabilities with demanding application needs. 

Register Here

Tescan at SEMICON Korea 2026

Booth D904

COEX Convention & Exhibition Center
513 Yeongdong-daero,
Gangnam-gu, Seoul 06164,
South Korea

semicon-korea-floor-plan