Tescan at ISTFA 2025:
Advancing Failure Analysis

FemtoChisel the first system where speed, quality, and correlation converge — accelerating inspection, failure analysis and targeted internal access, lowering cost-per-sample while handling the most heterogeneous materials in todays and tomorrow’s microelectronics. One platform, any sample, pristine results.

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FemtoChisel

Faster. Cleaner. Damage-Free.


Tescan FemtoChisel delivers up to 5× faster prep with debris-free, pristine cross-sections—no heat damage, no FIB rework.

 

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Featured Presentations

Monday November 17
10:20–10:40
Lukas presentation ISTFA

Leveraging Automation of TEM Sample Preparation for Increased Throughput and Reproducible Results from Advanced Multimodal STEM Analysis of 3-nm FinFET Transistors

Lukáš_Hladík_ct_m-1 by Lukáš Hladík
Wednesday November 19
03:00–04:00
Daniel Poster istfa

Microscopy Analysis and Material Characterization - Streamlining Accurate 4D-STEM Phase-Orientation Analysis of Polymorphic Polycrystalline Thin Films in Semiconductor TEM Labs for Routine Application

Daniel_Němeček_ct_m-3 by Daniel Němeček, Ph.D.