Defect Localization
High-resolution SEM imaging and navigation for identifying areas of interest.
From Buried Defect to Clear Answer
Site-Specific Sample Preparation
Advanced FIB and laser-based techniques for cross-sectioning and accessing buried structures.
Nanoscale Characterization
High-resolution imaging and analytical STEM techniques to investigate material structures and failure mechanisms.
Workflow Efficiency
Complementary technologies that help reduce time-to-answer while maintaining analytical precision.
Hands-on Microscopy Workshops
Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
12:45 - 13:45
February 27, 2023
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
x
February 27, 12:45 - 13:45, LL Copernicum, level 0
Fill the form to register for a workshop
M&M Scientific Program
Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale
12:45 PM - 01:45 PM
February 27, 2023
Application Specialist for FIB-SEM, TESCAN
Limited seats available
x
From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale
February 27, 12:45 PM - 01:45 PM, booth 123
Fill the form to register for a workshop
Workshop details
Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.
Located at TESCAN's Booth 1324
Get a Quick Look at Tescan's Failure Analysis Workflow
EXPLORE TESCAN'S INTEGRATED SEMICONDUCTOR FAILURE ANALYSIS WORKFLOW.
.png?width=919&height=829&name=TENSOR%20RD%202023%20Award%20(1).png)
Workflow
Advanced imaging and analytical characterization, including 4D-STEM, to investigate nanoscale structures and material properties.
You can visit directly at Tescan Booth 414.
Workflow
FemtoChisel™ – Femtosecond laser sample preparation
Laser-based material removal for rapid access to buried structures, cross-sectioning, and semiconductor sample preparation.
You can visit directly at Tescan Booth 414.
Workflow
Large-volume material removal, 3D characterization, and site-specific sample preparation for complex semiconductor structures.
You can visit directly at Tescan Booth 414.
Hear from Tescan Experts
Attend Scientific Presentations
From Access to Insight An AI-Based End-to-End Failure Analysis Pipeline Combining Laser Sample Prep, Correlative Navigation, and Automated Image Analytics
15:20 - 15:40
November 1, 2027
Head of AI and Advanced Solutions - Laser Technology
Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
15:00 - 16:00
November 2, 2027
Product Sales Lead - STEM
High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
15:00 - 16:00
November 2, 2027
Head of AI and Advanced Solutions - Laser Technology
x
From Access to Insight An AI-Based End-to-End Failure Analysis Pipeline Combining Laser Sample Prep, Correlative Navigation, and Automated Image Analytics
November 1, 15:20 - 15:40, Bridge Hall
Fill the form to register for a workshop
x
Enabling Efficient Strain Analysis of Advanced Nodes with STEM Nanobeam Diffraction Enhanced by Beam Precession at Sub-2nm Spatial Resolution
November 2, 15:00 - 16:00, Exhibit Hall
Fill the form to register for a workshop
x
High-Throughput Laser Sample Preparation and Device De-processing with LPL and Intelligent Multigas Processing, Reserving FIB for Final High-Resolution Steps
November 2, 15:00 - 16:00, Exhibit Hall
Fill the form to register for a workshop
Discuss your failure analysis and advanced packaging challenges with Tescan application experts
Hervé Macé
Semiconductor Business Development (Global)
Lukáš Hladík
Semiconductor Product Marketing
Michael Gray
Semiconductor Business Development (North America)
Trevan Landin
FIB-SEM Business Development (North America)
Pouya Tavousi, Ph.D.
Head of AI and Advanced Solutions - Laser Solutions
Dave Zapotok
Product Sales Lead - Laser Solutions
Daniel Nemecek, Ph.D.
Product Sales Lead - STEM Solutions
Malcolm Warrand
Vice-President of Sales (Americas)
Scott Fuller, Ph.D.
Sales Manager (US Northwest)
Jane Kim
Sales Manager (US Southwest)
Sam Habib
Area Sales Director (Singapore)
Santiago Alvarez
Area Sales Director (US West & South America)
