Microscopy & Microanalysis (M&M) Conference 2026
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Join Tescan for an Unforgettable Experience at IMC21

The 21st International Microscopy Congress (IMC21) will provide a global platform for speakers and delegates to share impactful and outstanding research that will inspire new generations of microscopists and promote new collaborative directions across the diverse scientific disciplines. 

Booth #233
August 31 - September 3, 2026
Liverpool, United Kingdom

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Why Visit Booth 233?

What to Expect?
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Live Product Demos 

See Tescan systems operating in real time and explore key features, workflows, and performance advantages.  

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Discover What’s New

Learn about the newest Tescan technologies, software enhancements, and application capabilities. 

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Talk to the Experts

Meet our application specialists and engineers to discuss your research challenges and workflow needs. 

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Practical Use Cases

Explore real-world examples showing how Tescan instruments deliver high-resolution, high-throughput research and industrial workflows. 

Book your instrument demo

Tescan FemtoChisel (2)
Laser

New: Tescan FemtoChisel™ 

Femtosecond Precision. Analysis-Ready Results. 

Demo at Tescan Booth 233

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Tescan FemtoChisel Laser

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Demo description 

Experience how FemtoChisel™ bridges the gap between sample localization and high-resolution analysis. Learn how femtosecond laser processing prepares samples for downstream FIB-SEM, TEM, and analytical microscopy workflows. 

Located at TESCAN's Booth 233

AMBER-X 2
PLASMA FIB-SEM

Tescan AMBER X™ 2 Plasma FIB-SEM

Powered by MISTRAL™, designed for clean, fast, precise prep

Demo at Tescan Booth 233

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Tescan AMBER X™ 2 Plasma FIB-SEM

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Demo description 

See how Tescan AMBER X™ 2 combines high-throughput Xe Plasma FIB milling with ultra-high-resolution SEM imaging to accelerate materials characterization, semiconductor failure analysis, and TEM sample preparation.

Discover:

  • Large-volume 3D characterization
  • Ga⁺-free TEM lamella preparation
  • High-resolution imaging of challenging materials
  • Correlative analysis with structural, chemical, and crystallographic insights

Join the live demo and explore faster pathways to nanoscale discovery.

Located at TESCAN's Booth 233

CLARA GM Mat. Science
UHR SEM

Tescan CLARA™ UHR-SEM 

Field-free UHR SEM for high-contrast imaging of sensitive materials.

Demo at Tescan Booth 233 

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Tescan CLARA™ 3 UHR-SEM

Select a slot

Fill the form to book a demo

If you would like to receive updates from TESCAN, please indicate your consent below.

By submitting this form, you acknowledge that TESCAN will process your personal data for the purpose of handling your request. For more information, including your rights, please see our Privacy Policy.

Demo description 

Unlock new insights with Tescan CLARA.
Join our experts for a live demonstration of Tescan CLARA and learn how researchers are using ultra-high-resolution FE-SEM imaging to characterize materials, investigate biological structures, and analyze advanced devices. See real-world applications, explore key workflows, and discover how CLARA transforms complex scientific questions into actionable answers. 

Located at Tescan's Booth 233

UniTOM HR2_left_shad kopie 33
MICRO-CT

New: Tescan UniTOM™ HR 2 micro-CT  

Uncompromised Discovery in Dynamic Micro-CT.

Demo at Tescan Booth 233

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New: Tescan UniTOM™ HR 2 micro-CT

Select a slot

Fill the form to book a demo

If you would like to receive updates from TESCAN, please indicate your consent below.

By submitting this form, you acknowledge that TESCAN will process your personal data for the purpose of handling your request. For more information, including your rights, please see our Privacy Policy.

Demo description 

Discover Tescan UniTOM HR 2, the dynamic micro-CT system combining sub-micron resolution and 4D imaging for non-destructive characterization across life sciences, materials science, geoscience, and semiconductor research. 

Located at TESCAN's Booth 233

Hands-on Microscopy Workshops

Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
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12:45 - 13:45
February 27, 2023

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Alan Speaker
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12:45 - 13:45
February 27, 2023

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Alan Speaker
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12:45 - 13:45
February 27, 2023

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Alan Speaker
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12:45 - 13:45
February 27, 2023

Ellipse 4
Alan Speaker
Save this session to the calendar
Rectangle 199

12:45 - 13:45
February 27, 2023

Ellipse 4
Alan Speaker
Save this session to the calendar
Rectangle 199

12:45 - 13:45
February 27, 2023

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Alan Speaker
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February 27, 12:45 - 13:45, LL Copernicum, level 0

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February 27, 12:45 - 13:45, LL Copernicum, level 0

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February 27, 12:45 - 13:45, LL Copernicum, level 0

Fill the form to register for a workshop
x

February 27, 12:45 - 13:45, LL Copernicum, level 0

Fill the form to register for a workshop
x

February 27, 12:45 - 13:45, LL Copernicum, level 0

Fill the form to register for a workshop
x

February 27, 12:45 - 13:45, LL Copernicum, level 0

Fill the form to register for a workshop

M&M Scientific Program

Join focused sessions led by TESCAN experts and explore advanced imaging techniques in depth.
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From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale

12:45 PM - 01:45 PM
February 27, 2023

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Petr Klimek, PhD
Application Specialist for FIB-SEM, TESCAN
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Limited seats available
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From Routine to Remarkable: MIRA XR – Analytical UHR-SEM Built for Throughput at Any Scale

February 27, 12:45 PM - 01:45 PM, booth 123

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Workshop details 

Introducing MIRA XR – the analytical SEM reimagined for speed, usability, and ultra-high-resolution imaging. Perfect for analytical workflows across materials science disciplines. Designed to deliver high throughput without compromising on resolution or automation. A productivity platform for every user, from QA labs to advanced research teams.

Located at TESCAN's Booth 1324 

Attend ORAL Presentations

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SEM as a Surface-Engineering Platform for Nanoprototyping: In Situ FEBID/FEBIE, Scripted Workflows, and Digital-Twin Process Control 

13:40 - 17:30
August 31, 2026

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Petr Klímek
Product Marketing Director
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High-Throughput TEM and NanoCT Specimen Preparation by Femtosecond Laser Micromachining

13:40 - 15:30
August 31, 2026

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Sina Shahbazmohamadi, Ph.D.
Head of Technology - Laser
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Increasing the efficiency of new materials development using advanced analytical 4D-STEM approaches: A case study of the AA2099 aluminum alloy

15:45 - 17:30
September 2, 2026

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Daniel Němeček
Product Sales Leader
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SEM as a Surface-Engineering Platform for Nanoprototyping: In Situ FEBID/FEBIE, Scripted Workflows, and Digital-Twin Process Control 

August 31, 13:40 - 17:30, 2L (Hall 2) 

Fill the form to register for a workshop
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High-Throughput TEM and NanoCT Specimen Preparation by Femtosecond Laser Micromachining

August 31, 13:40 - 15:30

Fill the form to register for a workshop
x

Increasing the efficiency of new materials development using advanced analytical 4D-STEM approaches: A case study of the AA2099 aluminum alloy

September 2, 15:45 - 17:30, Exhibit Hall

Fill the form to register for a workshop

Read our posters

No. 289 - 3D Multiscale Porosity Characterization in Hydroxyapatite-Zirconia Composites Through Integration of FIB-SEM and MicroCT Beyond Topographical SEM Contrast Detection Limits

No. 98 - Employing Xe Plasma FIB for Fast and Precise Sample Preparation

No. 910 - Dynamic to Detail: Advanced Micro-CT for Quantifying Tablet Dissolution and Disintegration

No. 832 - Multimodal Correlative Characterization of Individual Lead Halide Perovskite Nanocrystals

No. 930 - Comprehensive Insights into Lithium-Ion Battery Electrode Structure and Composition through Multimodal 3D FIB-SEM, EDS, and ToF-SIMS Tomography

No. 30 - CT-Informed Laser Decapsulation and Delayering for Multiscale Microscopy of Consumer Electronics

No. 32 - High-Fidelity Laser-Milled Access Windows for SEM-Based Failure Analysis

No. 29 - Microscopy-Grade, Rapid Laser Cross-Sectioning for Microelectronics

Our users experience 

Ben Britton and colleagues (RWTH Aachen and University of British Columbia)

 

Leveraging EBSD for subtle crystallographic details: A case study of specific triple layer spacing and site lattice occupancies in Nb-Ni and Nb-Comu phases 

15:45 - 17:30
Thursday, 3 September 2026
2E (Hall 2)
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Meet the Microscopy Experts

Your challenges. Expert insights in microscopy, imaging, and analysis.
Antonín-Doupal

Antonín Doupal

Tescan FIB SEM

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Kathrin Rudolph,
Ph.D. 

 Life Science Solutions 

Neil Stephenson

Neil Stephenson

Area Sales Director  

omar-matar

Omar Matar

Sales Manager - UK

colin-edward

Colin Edwards

Sales Manager - UK

Jacques Vennik

Jacques Vennik

Customer Service Director, EMEA

Visit Us at Booth #233

Meet at IMC21

Booth #233
August 31 - September 3, 2026


Liverpool, United Kingdom

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

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Frequently asked questions

What is IMC21?

The International Microscopy Congress (IMC21) is a global event that brings together researchers, scientists, and industry experts to share advances in microscopy, imaging, and analytical technologies across multiple scientific disciplines.

What will Tescan showcase at IMC21?

Tescan will present advanced FIB-SEM, SEM, and micro-CT solutions, including live demonstrations and workflows supporting materials science, life sciences, and semiconductor research.

What technologies can visitors explore at the Tescan booth?

Visitors can explore FemtoChisel femtosecond laser processing, CLARA UHR-SEM, AMBER X Plasma FIB-SEM, and UniTOM HR micro-CT systems, along with integrated analytical workflows.

What can attendees expect from visiting Tescan at IMC21?

Attendees can experience live product demonstrations, discuss applications with experts, and explore real-world use cases for high-resolution imaging and materials characterization.

What topics will be covered in Tescan presentations?

 Tescan presentations cover nanofabrication, advanced microscopy workflows, laser-based sample preparation, 4D-STEM analysis, and high-throughput specimen preparation techniques. 

How are FIB-SEM and micro-CT used in microscopy workflows?

FIB-SEM and micro-CT are used for high-resolution imaging, 3D analysis, and sample preparation, enabling detailed characterization of materials across multiple length scales.

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