On-demand WEBINAR | Tescan EXLO^™: Faster TEM Sample Preparation with Ex Situ Lift-Out

About this webinar

TEM sample preparation is often a bottleneck in advanced microscopy workflows. Traditional in situ lift-out keeps valuable FIB-SEM systems occupied, limiting throughput and increasing cost per sample.

In this webinar, we introduce EXLO™ (ex situ lift-out), a solution that moves the lift-out step outside the FIB-SEM. This enables parallel processing and significantly improves laboratory efficiency.

You will learn how EXLO™ helps laboratories:

• Increase TEM sample throughput
• Reduce reliance on FIB time
• Lower cost per specimen
• Improve workflow scalability

What You'll Learn: 

Key Benefits of EXLO™

1. Higher throughput
Move specimen manipulation outside the FIB and process multiple samples faster.

2. Reduced cost per sample
Free up expensive FIB time for milling instead of manipulation.

3. Faster workflows
Specimen transfer can take less than 30 seconds, even for new users.

4. Easy to learn and use
Even first-time users can quickly achieve reliable results.

5. Flexible and scalable solution
Supports multiple FIB systems and a wide range of materials.

This webinar is ideal for:

• Semiconductor laboratories

• Materials science and metallurgy labs

• Core microscopy facilities

• TEM/FIB operators and managers

Especially relevant if you:

• Need to increase throughput without investing in another FIB

• Want to reduce cost per lamella

• Manage high sample volumes or shared instruments

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