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16th ASEM Workshop on Advanced Electron Microscopy     

Tescan will participate in the 16th ASEM Workshop on Advanced Electron Microscopy, taking place 20–21 April 2026 at the Institute of Science and Technology Austria (ISTA), Klosterneuburg, Austria. This leading advanced electron microscopy workshop brings together researchers and technology specialists working across high-resolution imaging, ion beam techniques, and materials characterisation. Meet the Tescan team to discuss the latest developments in FIB-SEM technology and analytical microscopy workflows.

20 - 21 April 2026

Tescan at ASEM 2026

Visit Tescan at Table no. 8 to explore application-driven solutions in focused ion beam scanning electron microscopy (FIB-SEM) and advanced ion beam control. Our team will be available to discuss system configurations, throughput optimisation, and integrated analytical approaches tailored to demanding research environments.

If you are working with complex materials, nanostructures, or high-resolution cross-sectioning, this is an opportunity to explore how FIB-SEM solutions can support both resolution and productivity.

Featured Presentation 

Balancing Resolution and Throughput Through Ion Beam Profile Control

This presentation will examine how precise ion beam profile control directly influences milling quality, imaging performance, and analytical efficiency. By optimising beam characteristics, users can achieve the right balance between high resolution and throughput in advanced microscopy workflows.

Who should attend

  • Electron microscopy and FIB-SEM users

  • Researchers in advanced materials science and nanotechnology

  • Facility managers seeking improved throughput in microscopy labs

  • Industry professionals evaluating high-resolution and ion beam-based analysis

Register using the form below to receive confirmation and updates about Tescan’s participation at ASEM 2026, including presentation details and opportunities to meet our team during the workshop. 

About Speaker

Martin Slama photo
Martin Sláma

Martin Sláma is Product Marketing Manager at Tescan, specialising in advanced FIB-SEM workflows for materials science applications. He has extensive experience in 3D characterisation, high-precision TEM sample preparation, and Ga FIB-SEM technology. His expertise includes artefact-free milling strategies and workflow automation designed to increase throughput without compromising analytical quality.

He regularly presents at international conferences and workshops, focusing on ion beam optimisation, resolution control, and practical approaches that balance speed, precision, and usability in electron microscopy.

Register Here

Tescan at SEMICON Korea 2026

Booth D904

COEX Convention & Exhibition Center
513 Yeongdong-daero,
Gangnam-gu, Seoul 06164,
South Korea

semicon-korea-floor-plan