Tescan at SEMICON Korea 2026: Accelerating Semiconductor Failure Analysis  

Revolutionary Solutions for Streamlined Failure Analysis in Advanced Packaging

Streamlined Failure Analysis for Advanced Packaging

SEMICON Korea, one of Asia’s leading semiconductor trade shows organized annually by SEMI (Semiconductor Equipment and Materials International), returned in 2026 under the theme "Transform Tomorrow". The exhibition highlighted the growing role of artificial intelligence across the semiconductor value chain, from research and chip design to manufacturing, testing, and integration. 

Over the course of three days, the event brought together 69,527 unique participants and 536 global exhibitors, creating a vibrant forum for discussing AI scalability, rising energy demands, and the technologies shaping the future of the semiconductor industry. 

At SEMICON Korea 2026, Tescan welcomed visitors at Booth D904, showcasing integrated, automation-driven workflows designed to accelerate semiconductor failure analysis in advanced packaging. These solutions help tackle the most demanding challenges by transforming traditionally complex and time-consuming analysis into a streamlined, automated, and highly precise process, reducing turnaround time from days to hours. 

Practical demonstrations highlighted damage-minimized, site-specific sample preparation, high-resolution 3D analysis and imaging, and non-destructive X-ray micro-CT inspection of packaged devices, enabled by solutions such as Tescan SOLARIS X 2, SOLARIS 2 with the Orage™ 2 FIB column, AMBER X 2, UniTOM HR, FemtoChisel, and TENSOR. 

“Participation in SEMICON Korea allows us to stay in direct contact with key market players, respond to evolving customer needs, and present advanced solutions for semiconductor analysis and quality control,” says Antonín Doupal, Product Sales Leader at Tescan, reflecting on the event. 

The event also provided valuable opportunities to engage with customers and industry partners and discuss emerging challenges and future opportunities in semiconductor analysis and advanced packaging.