WEBINAR | Up to 40% Faster Automated TEM Lamella Preparation with new Ga⁺ FIB Column

FIB-SEM Cross-Sectioning and 3D Characterization for Advanced Materials 

 

FIB-SEM cross-sectioning reveals the hidden structures that govern material performance. From grain boundaries to porosity, precise 3D characterization supports research, quality assurance, and failure analysis.

FIB-SEM Cross-sectioning and 3D Characterization
FIB-SEM Cross-sectioning and 3D Characterization

Contents

Optimizing FIB-SEM Efficiency for Faster Time-to-Data

FIB-SEM studies are often limited by milling speed and time-consuming setup. Tescan plasma FIB streamlines large-volume cross-sectioning and tomography, delivering faster and more reproducible datasets.Accelerate sample preparation and 3D reconstruction

  • Automate routine workflows to reduce operator time
  • Enable large-volume cross-sectioning for statistically meaningful 3D datasets

 

Large cross section from diod sample polished without protective layer
Large Area Sample Preparation – Low Angle Polishing for EBSD

Preparing EBSD-ready surfaces across millimeter-scale regions is challenging when using conventional approaches. Tescan plasma FIB enables low-angle polishing over large areas while minimizing sample damage.

  • Prepare EBSD surfaces free of curtaining artifacts
  • Preserve microstructural integrity across large sample areas
  • Ensure high-quality diffraction data for crystallographic studies
Detail of duplex steel polished surface by Low Angle Polishing method-6
Multimodal 3D FIB-SEM Characterization

Complex materials demand more than structural imaging. Tescan FIB-SEM platforms integrate 3D tomography with EDS, EBSD, and ToF-SIMS for correlative insights into chemistry and crystallography.

  • Combine 3D structural, chemical, and crystallographic data
  • Analyze multi-phase and heterogeneous materials in context
  • Enable complete datasets from a single instrument workflow
Battery cathode 3D FIB-SEM tomography combining datasets from ToF-SIMS and EDS within single visualization-8
Porosity Mapping in Fiber-Reinforced Ceramics: A Multiscale 3D Approach

Fiber-reinforced ceramics rely on porosity distribution for mechanical performance and bioactivity. Tescan’s multiscale imaging approach connects micro-CT with high-resolution FIB-SEM tomography.

  • Map porosity networks from micron to nanometer scales
  • Quantify pore connectivity and anisotropy in composites
  • Correlate porosity to mechanical performance and bioactivity
Segmented porosity from the microCT dataset
Precise Preparation of Large Samples for In-Situ Synchrotron Studies

Synchrotron experiments require site-specific preparation of large or irregular samples with minimal preparation damage. Tescan plasma FIB systems provide the control and volume capacity needed for beamline studies.

  • Mill large volumes while preserving structural fidelity
  • Prepare synchrotron-ready samples with high accuracy
  • Enable correlative workflows between FIB-SEM and synchrotron imaging
Al-Mn-Cr-Zr alloy sample block prepared by PBF-LB process-1
Smart Oxygen Injection for Selective Milling

Selective milling of oxides, polymers, or other sensitive materials can be difficult with conventional FIB approaches. Tescan’s smart oxygen injection technology enables controlled and targeted removal of these materials mentioned above.

  • Improve material milling speed during FIB milling
  • Reduce redeposition and enhance surface quality
  • Minimize carbon redeposition on the milled surface and surrounding areas
100 nA Polishing + Oxygen BC-4 (1)

TESCAN Instruments & Technology

Used in This Workflow

Tescan AMBER X 2

High-throughput plasma FIB-SEM for EBSD-ready sample surfaces.

  • Use Xe+ plasma FIB for high-throughput tomography and large volume milling
  • Prepare large, deformation-free areas with Low-Angle Polishing
  • Minimize curtaining and surface damage for reliable EBSD patterns
  • Ensure reproducible crystallographic mapping in complex materials 
AMBER-X 2

Tescan AMBER X 2 with ToF-SIMS

Plasma FIB-SEM systems for multimodal 3D battery material characterization.

  • Utilize Xe⁺ plasma FIB for high-throughput cross-sectioning and large-volume milling of battery electrodes.
  • Integrate ToF-SIMS and EDS for correlative 3D chemical and structural mapping.
  • Achieve a comprehensive understanding of internal battery processes using multiple correlative analytical techniques integrated within a single system
AMBER-X-TOF (1)

Tescan OptiGIS O2 Module

Smart oxygen injection system for enhanced plasma FIB-SEM performance.

  • Improve milling selectivity and surface smoothness
  • Enhance SEM contrast in polymers, composites, and carbon-rich samples
  • Reduce redeposition artifacts for accurate subsurface imaging

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