Gain Clarity for Faster Process Development with Package Metrology Workflows 

 

Accelerate process development with real-time phase and orientation mapping. Get clear insight into nanoscale structures to guide decisions with speed and confidence.

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Tescan solutions

for advanced research in semiconductors
Fast 4D-STEM Phase Mapping for PCM Devices

Combine Tescan’s 4D-STEM workflow with integrated beam precession to achieve fast, accurate phase and orientation mapping in semiconductor devices. Structural insights are delivered in under 15 minutes, supporting both failure analysis and process optimization.

  • Precession-assisted 4D-STEM: Minimizes dynamical effects and captures crystalline, amorphous, and mixed-phase regions in a single scan
  • Real-time mapping: Provides immediate results with automated cross-correlation and no manual tuning
  • High-throughput analysis: Reveals structural changes in materials like PCM for reliable process development
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Tescan Solutions

for Metrology and Process Development

Tescan TENSOR

Tescan TENSOR is an analytical STEM platform for fast, reproducible strain, phase, and composition analysis of semiconductor devices.

It integrates 4D-STEM, beam precession, and high-throughput EDS to deliver precise nanoscale structural and elemental characterization. Optimized for automation and consistency, TENSOR ensures high productivity across shifts and sites.

  • Precession-enhanced 4D-STEM: Provides high-precision strain and phase mapping, even at the 3 nm node

  • Automated alignments and workflows: Reduce operator variability with real-time data processing

  • Low-dose, high-current operation: Minimizes sample damage and contamination in near-UHV conditions
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Where can you find us:

Tescan Brno
Libušina třída 21
623 00 Brno
Czech Republic

info@Tescan.com