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Efficient TEM and APT Sample Preparation for Reliable Insights 

 

TEM and APT sample preparation defines the quality of nanoscale characterization. With automated FIB-SEM workflows, researchers achieve reproducible, damage-free lamellae that accelerate discovery and strengthen confidence in results.

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TEM and APT Sample Preparation
TEM and APT Sample Preparation

Contents

Enabling Overnight, High-Yield TEM Preparation in Materials Science Labs

Routine TEM sample preparation often limits productivity. With TESCAN’s automated plasma FIB-SEM workflows, high-throughput preparation can run overnight, maximizing microscope utilization.

  • Enable unattended, automated TEM lamella production
  • Increase yield of high-quality samples per day
  • Free up researchers’ time for analysis instead of preparation
See application
TEM image of ZrO2 acquired with TENSOR microscope from TEM sample prepared automaticaly and particular phase map
High-Quality TEM Samples with Plasma FIB-SEM

Ion implantation and damage layers compromise TEM analysis. TESCAN plasma FIB-SEM technology delivers clean lamellae with reduced damage, even on sensitive materials.

  • Minimize Ga+ implantation by using Xe plasma FIB milling
  • Produce damage-free surfaces for accurate structural analysis
  • Maintain integrity of delicate or beam-sensitive materials
See application
image5-35-1 (1)
Automated TEM Final Polishing for Reproducibility

Manual final thinning is a major source of variability in TEM workflows. Automated routines in TESCAN systems ensure consistent, repeatable lamella polishing for robust results.

  • Standardize final polishing to reduce operator bias
  • Improve reproducibility across multiple samples and users
  • Support statistically reliable research outcomes
See application
Array of TEM samples prepared from several materials with minimal adjustments to the automated template-1 (1)
TEM Preparation from Challenging Materials and Geometries

Not all samples are easy to thin — composites, multi-layered structures, or unusual geometries present difficulties. TESCAN FIB-SEM solutions provide flexible strategies to address these challenges.

  • Adapt workflows to complex or non-standard geometries
  • Handle hard–soft or multi-phase material combinations
  • Expand applicability of TEM preparation to diverse research fields
See application
Stacking faults at the interface revealed using the HADF STEM detector in FIB-SEM-1 (4)
Streamlined TEM Preparation in Materials Science Labs

Efficient workflows are essential in labs with high sample demand. TESCAN automation and intuitive software streamline preparation steps, reducing turnaround time.

  • Integrate routine tasks into guided workflows
  • Shorten preparation times from hours to minutes
  • Increase lab productivity without compromising quality
See application
Detail HAADF TEM image of Si sample showing dumbbell structure in crystallographic orientation [110]-1 (1) (1)

TESCAN Instruments & Technology

Used in This Workflow

Tescan AMBER 2

Versatile Ga+ FIB-SEM for precise TEM sample preparation.

  • Perform site-specific thinning with nanometer accuracy
  • Enable reproducible final polishing for damage-free lamellae
  • Support reliable (S)TEM and APT investigations across diverse materials

 

AMBER 2

Tescan AMBER X 2

High-throughput plasma FIB-SEM for efficient TEM and APT sample preparation.

  • Produce multiple lamellae overnight with automated workflows
  • Minimize ion implantation and surface damage with plasma milling
  • Streamline high-yield preparation for advanced nanoscale characterization
AMBER-X 2

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Tescan
Libušina třída 21
623 00 Brno
Czech Republic

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