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Do you want to reduce the time and cost of sample preparation for failure analysis?
“Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry,” by Rodrigo Delgadillo Blando, et al., is a paper that was presented at the ISTFA conference in 2021, and it describes an innovative method for preparing large-volume cross-sections of microelectronic devices using a ps-laser ablation tool and a Xe Plasma FIB-SEM system. This is very relevant and cutting-edge research that aims to improve the efficiency and accuracy of the failure analysis of microelectronic devices.
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Do you want to reduce the time and cost of sample preparation for failure analysis?
“Pairing Laser Ablation and Xe Plasma FIB-SEM: An Approach for Precise End-Pointing in Large-Scale Physical Failure Analysis in the Semiconductor Industry,” by Rodrigo Delgadillo Blando, et al., is a paper that was presented at the ISTFA conference in 2021, and it describes an innovative method for preparing large-volume cross-sections of microelectronic devices using a ps-laser ablation tool and a Xe Plasma FIB-SEM system. This is very relevant and cutting-edge research that aims to improve the efficiency and accuracy of the failure analysis of microelectronic devices.
