Brno, Czech Republic – September 16, 2025 – The week at the 32nd IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2025) in Penang from August 5 to 8 delivered what the semiconductor industry needs most: education, practical discussion, and forward-looking solutions.
Key Themes Reflected in Tescan’s Booth
The event placed a spotlight on the convergence of automation, AI, and real-time reliability insights. These themes are exactly where Tescan’s solutions excel. IPFA’s program featured three keynotes, eight tutorials, six workshops, invited talks, user-group panels, and the always creative “Art of FA” contest, all of which created a week full of learning and collaboration.
Tescan used the opportunity to show how our instruments address these challenges in practical, commercially relevant ways.
Tescan: From Challenges to Solutions
Challenge: High failure rates and increasing reliability demands
Solution: Automated precision and QA-ready imaging
Tescan’s high-throughput FIB-SEM platforms deliver rapid fault navigation from defect detection to root-cause analysis, helping teams keep pace with demanding production schedules without compromising detail.
Challenge: Complexity in package structures
Solution: Pair non-destructive micro-CT for 3D localization with a stand-alone laser and a Mistral™ Plasma FIB-SEM on SOLARIS X 2
Engineers can target buried regions with confidence and keep the same coordinates from localization to exposure to inspection. This integrated approach shortens time to insight on multilayer and 3D stacks.
Challenge: Fast turnaround for yield-driven fabs
Solution: Seamless workflow integration
TESCAN integrated workflow streamline sample preparation and imaging with near-automated workflows. The result is greater consistency, reduced operator variability, and repeatable results that match tight production timelines.
Challenge: Maximizing uptime and global support
Solution: Service-first partnership
At IPFA, Tescan demonstrated its commitment to supporting labs and fabs with proactive planning, preventive maintenance, and rapid service. We do not just deliver instruments; we deliver lasting reliability.
Why Visitors Took Notice
We presented an approach that blends AI-enhanced capabilities with robust, dependable instruments designed for commercial environments. Our message was clear: Tescan puts commercial customers first, helping semiconductor manufacturers improve yield, efficiency, and speed.
Next Steps: Optimize Your FA Lab with Tescan
If your team is facing rising demands in failure analysis, reliability testing, or packaging inspection, Tescan can help you meet those goals.
- Book a commercial-focused demo of Micro-CT, Slolaris X 2, , Amber X 2, Tensor, and see how they address your specific challenges.
- Request custom advice on integrating Tescan into your FA workflow, whether for in-house labs, service centers , or vendor QA operations.
In Summary
IPFA 2025 was a key moment for the semiconductor industry. It brought current challenges into focus and highlighted the tools that solve them. Tescan was at the center of these discussions, offering proven, efficient, and commercially relevant solutions backed by exceptional service. We are ready to help your operations run smarter, faster, and with greater consistency than ever before.