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Enhance SEM Observation During FIB Cross-Sectioning with Tescan’s Rocking Stage 

Apply Tescan SOLARIS X 2 with Rocking Stage to achieve smooth, artifact-free plasma FIB cross sections for TSVs, solder bumps, and MEMS packaging structures.

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Overcome Curtaining in Plasma FIB Cross Sections with Rocking Stage on TESCAN SOLARIS X 2

Large-area cross sections are essential for analyzing TSVs, solder bumps, and packaged ICs. Yet plasma FIB milling, while fast, often produces rough surfaces with curtaining artifacts, especially in heterogeneous materials. Multi-angle milling can reduce these effects, but traditional stage designs make the process slow, complex, and difficult to monitor.

Tescan SOLARIS X 2 with Rocking Stage introduces tilting in the plane of the cross section, enabling alternating-angle polishing under continuous SEM observation. This ensures smoother surfaces, precise endpoint detection, and efficient preparation of high-quality cross sections for reliable semiconductor failure analysis.

Why Improve Cross Section Polishing

with Rocking Stage on Twscan SOLARIS X 2

01
Root of the Problem

Why Plasma FIB Cross-Sections Often Fall Short in Semiconductor Failure Analysis

Large-area cross sections are essential for analyzing solder bumps, TSVs, and packaged ICs. Plasma FIB systems deliver the speed for such preparations, but surface quality often suffers, with curtaining artifacts obscuring critical details in heterogeneous materials.

Multi-angle milling can reduce curtaining, yet conventional stages tilt only perpendicular to the beam. Polishing then requires repeated repositioning, disrupts SEM imaging, and complicates endpoint detection — leading to inefficiency and uncertain results.

Tescan SOLARIS X with Rocking Stage overcomes these limits by tilting in the plane of the cross section. This allows artifact-free polishing under continuous SEM observation for precise endpointing.

  • Multi-angle polishing minimizes curtaining and surface roughness
  • SEM monitoring during milling ensures precision and reliability
  • Integrated workflow saves time by removing repositioning steps
  • Large, smooth cross sections are ready for high-quality analysis
  • Streamline semiconductor failure analysis with consistent, high-quality results using Tescan’s rocking stage technology.

02
Materials and Methods

How Plasma FIB Cross-Sectioning Was Performed Using Tescan SOLARIS X 2 with Rocking Stage

Semiconductor packaging samples with solder bumps, TSVs, and copper pillars were selected to demonstrate large-area plasma FIB cross-sectioning. SEM imaging was first used to define the region of interest and assess structural context.

The rocking stage introduced tilt in the plane of the cross section, enabling alternating-angle milling during Xe plasma FIB operation. Continuous SEM/BSE imaging was maintained to monitor surface quality and guide endpoint detection.

Cross sections were then compared with and without rocking, and final SEM inspection confirmed curtaining suppression, preserved interfaces, and suitability for follow-up measurements.

This workflow shows how Tescan SOLARIS X 2 with Rocking Stage enables high-quality, artifact-free cross sections in heterogeneous semiconductor structures without workflow interruption.

03
Results and Discussion

Rocking Stage Cross-Sectioning Improves Surface Quality and Endpoint Precision

Tescan SOLARIS X 2 with Rocking Stage enabled preparation of large-area plasma FIB cross sections in heterogeneous semiconductor structures such as solder bumps, TSVs, and copper pillars. Conventional plasma FIB milling produced curtaining and rough surfaces, particularly at material interfaces, limiting the reliability of structural evaluation.

With the rocking stage, alternating-angle milling significantly reduced curtaining artifacts. Continuous SEM/BSE observation during polishing allowed precise endpoint detection and ensured that key interfaces remained intact. Cross sections prepared using the rocking workflow showed smooth, uniform surfaces that were immediately suitable for high-resolution SEM imaging and follow-up metrology.

Comparative results highlighted clear advantages over traditional perpendicular milling. Samples processed with the rocking stage demonstrated improved visibility of microstructural features, consistent surface quality across different materials, and reduced preparation time. This makes the workflow especially valuable for semiconductor failure analysis, packaging evaluation, and quality control.

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Tescan Instruments & Technology

Used in This Workflow

Tescan SOLARIS X 2 with Rocking Stage 

Tescan SOLARIS X 2 with Rocking Stage combines high-throughput Xe plasma FIB milling with simultaneous SEM observation to deliver smooth, artifact-free cross sections in complex semiconductor structures.

 

The integrated rocking stage introduces tilt in the plane of the cross section, reducing curtaining and enabling precise endpointing during polishing.

 

  • Rocking stage integration: enables alternating-angle milling for smoother surfaces

  • Continuous SEM/BSE observation: supports real-time monitoring and accurate endpoint detection

  • Xe plasma FIB technology: provides fast material removal for large-area cross sections

  • Improved surface integrity: preserves interfaces in solder bumps, TSVs, and copper pillars

  • Streamlined workflow: eliminates repositioning steps and reduces preparation time 
SOLARIS-X2
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Where can you find us:

Tescan
Libušina třída 21
623 00 Brno 
Czech Republic

info@Tescan.com 

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