WEBINAR | “4D-STEM in SEM” – an event-based approach to accessible nano-scale materials characterization
Enroll now for free

Accelerate Failure Analysis with Hybrid Laser and Plasma FIB Workflow  

Achieve accurate, geometry-true cross-sections with the Hybrid Laser and Plasma FIB Workflow using CAD/GDS overlay navigation.

Book a demo
Pairing Laser Ablation and Xe Plasma FIB-SEM
Pairing Laser Ablation and Xe Plasma FIB-SEM
Unlocked content

Streamline Cross-Sectioning of Complex Devices with Hybrid Laser and Plasma FIB 

As semiconductor devices grow in size and complexity, preparing cross-sections for failure analysis becomes increasingly difficult. Plasma FIB milling is precise but too slow for bulk removal, while mechanical sectioning introduces stress, chipping, and delamination. In layered assemblies like AMOLED displays or 3D memory stacks, small errors in end pointing can damage internal layers and compromise analysis.

The Hybrid Laser and Plasma FIB Workflow resolves these challenges by combining femtosecond laser ablation for rapid bulk removal with Xe plasma FIB-SEM for precision polishing. With bitmap overlays and CAD/GDS correlation, it ensures accurate navigation and geometry-true sections—clean, SEM-ready surfaces across flip-chips, memory stacks, and advanced displays in minutes.

Why Cross-Section Complex Semiconductor Devices

with a Hybrid Laser and Plasma FIB Workflow

01
Root of the Problem

Why Conventional Cross-Sectioning Workflows Fail in Complex Devices

Advanced packages like AMOLED displays, flip-chips, and 3D memory stacks demand precise failure analysis, yet traditional sample preparation creates major obstacles. Plasma FIB milling alone is accurate but impractically slow for large-volume removal, often taking hours to expose millimeter-scale areas. Mechanical sawing is faster, but introduces artifacts such as chipping, delamination, and stress that distort delicate internal layers.

Navigating layered assemblies compounds the problem—manual endpointing and tool-switching increase the risk of damaging critical structures. These limitations reduce efficiency, compromise data integrity, and slow semiconductor development.

The Hybrid Laser and Plasma FIB Workflow eliminates these barriers by combining laser speed with FIB precision for fast, artifact-free cross-sections.

02
Materials and Methods

How Hybrid Laser and Plasma FIB Cross-Sectioning Was Performed

Large-area semiconductor samples, including flip-chips, AMOLED panels, and stacked memory dies, were prepared using a combined femtosecond laser and Xe plasma FIB-SEM workflow.

Femtosecond laser ablation enabled rapid bulk removal of millimeter-scale regions, replacing hours of plasma FIB milling. Plasma FIB polishing then refined surfaces to produce smooth, artifact-free cross-sections suitable for SEM and EDS inspection.

Bitmap image overlays, CAD navigation, and GDS alignment ensured precise targeting and geometry-true sectioning, while tilt-capable laser stages corrected taper angles. This fully integrated approach delivered clean, reproducible cross-sections across diverse device architectures.

03
Results and Discussion

Hybrid Cross-Sectioning Demonstrates Speed and Integrity Across Semiconductor Devices

The Hybrid Laser and Plasma FIB Workflow enabled rapid, large-volume cross-sectioning of flip-chips, AMOLED displays, and 3D memory stacks. Laser ablation reduced bulk removal from hours to minutes, while plasma FIB polishing delivered smooth, geometry-true surfaces free from chipping or delamination.

SEM imaging confirmed intact internal structures, with delicate layers preserved for EDS and further analysis. CAD/GDS overlay navigation ensured accurate end pointing across complex assemblies, supporting reproducible preparation.

Together, these results demonstrate faster, artifact-free workflows that outperform conventional plasma FIB or mechanical sawing in both throughput and sample integrity.

GET IN Touch

Contact us

Get the most out of Tescan

This is more than information; it's an advantage. We've compiled our technical whitepapers, detailed product flyers, and on-demand webinars to provide you with the knowledge that makes a real difference. Sign up now to access the insights you need to make an impact.

Tescan Instruments & Technology

Used in This Workflow

Tescan SOLARIS X™ 2 with Xe Plasma FIB-SEM 

Tescan SOLARIS X™ 2 combines high-throughput Xe plasma FIB milling with high-resolution SEM imaging to prepare large, geometry-true cross-sections of complex semiconductor devices. Its wide current range and precision control make it ideal for both rapid bulk removal and fine surface polishing.

  • Xe plasma FIB: enables fast removal of millimeter-scale volumes without thermal damage
  • SEM column: delivers high-resolution imaging for surface inspection and analysis
  • Large-current range (up to 3.3 μA): supports both speed and precision in a single system
  • True X-Sectioning: ensures clean, artifact-free surfaces ready for SEM/EDS analysis
  • Automation-ready platform: reproducible workflows for semiconductor failure analysis
SOLARIS-X2
Find out more

Tescan Bitmap Image Overlay Navigation 

Tescan’s bitmap overlay function aligns design data directly with SEM/FIB imaging, enabling precise targeting of critical device layers. Engineers can correlate CAD or GDS layouts with live images to improve endpoint accuracy and reproducibility.

  • CAD/GDS overlay: match design files with real-time imaging
  • Accurate targeting: identify and cross-section specific device features
  • Reproducible end pointing: reduce operator dependence and guesswork
  • Cross-platform integration: ensures consistency across analysis workflows

Tescan Tilt-Capable Laser Stages 

Tescan’s laser solutions includes tilt-capable stages that correct taper angles during femtosecond laser trenching. This ensures straight, geometry-true cross-sections that simplify follow-up FIB polishing and SEM inspection.

  • Tilt correction: eliminate tapering for clean trench geometry
  • Accurate large-area sectioning: maintain true-to-design dimensions
  • Seamless integration: laser preparation combined with FIB polishing in one workflow
  • Reliable results: preserve delicate device structures without distortion

GET IN Touch

with specialist
map

Where can you find us:

Tescan
Libušina třída 21
623 00 Brno 
Czech Republic

info@Tescan.com 

130405923 us US 37.09024 -95.712891 25.3575 29.349345 20.67957527 42.082797 39.91384763 -33.693421 13.93320106 3.039986586 31.997988 38.050985 47.579533 48.1485965 58.375799 54.663142 19.195447 56.975106 47.916997 50.493053 45.868592 10.79556993 44.35660598 43.2371604 55.536415 14.557577179752773 32.100937 -6.116829 -6.212299277967318 33.600194 -12.08688 23.7104 -33.471062 31.998740087 -23.69149395 43.462349 51.529848 49.1893523 49.197486 25.072375 31.075811 1.299027 40.676979 52.30150662 51.013813 35.684121 37.566531 52.246622 40.581349 39.911632 -26.1811371 41.818215 33.429928

No distributors found.