WEBINAR | Dynamic-to-Detail Micro-CT in One Workflow: UniTOM HR 2

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Accelerate Micro-CT for Consumer Electronics from Full Devices to Components with Tescan 

Use Tescan UniTOM systems to perform Micro-CT for consumer electronics that delivers non-destructive 3D imaging from full devices to component-level inspection.

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Micro-CT for consumer Electronics
Micro-CT for consumer Electronics
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Overcome Teardown Challenges with Micro-CT for Consumer Electronics

Consumer electronics are densely packed with delicate components, making traditional inspection methods destructive and time-consuming. Critical defects — such as voids in solder joints, swelling in batteries, or leaks in waterproofing seals — can remain hidden until devices fail in use

Tescan UniTOM systems enable fast, non-destructive Micro-CT for consumer electronics. From full-device scans to high-resolution component inspection, engineers can visualize internal structures in real time, detect hidden faults, and validate device integrity without disassembly.

Why Using Micro-CT for Non-Destructive Testing

of Consumer Electronics Makes Sense?

01
Root of the Problem

Why Internal Inspection of Devices Remains a Challenge

Consumer electronics are packed with small, tightly arranged components that are difficult to access once the device is assembled. Solder joints, batteries, pressure seals, and memory modules often fail in ways that cannot be detected from the outside.

Disassembly carries the risk of damaging fragile parts or changing the internal structure. Conventional imaging methods rarely provide true 3D context or access to components embedded deep inside.

To analyze these systems effectively, failure analysis and quality control teams need a method that combines full-system access with targeted resolution, dynamic testing, and real material contrast, without altering the sample.

02
Materials and Methods

This Workflow uses the Tescan UniTOM XL and UniTOM HR micro-CT systems for multi-scale inspection of consumer electronics. 

 

Scanning process and tools include: 

  • Volume-of-Interest (VOIs™) scanning: fast overview scan followed by higher resolution zoom without re-positioning
  • Dynamic CT for in-situ testing: environmental stages powered via slip rings for continuous acquisition under load, temperature, humidity, ... 
  • Real-time acquisition and processing using Aquila™ and Panthera™ software platforms
  • Spectral CT mode: energy-resolved imaging based on K-edge contrast for material separation

03
Results and Discussion

Multi-Scale Micro-CT Reveals Hidden Defects in Consumer Electronics

Tescan UniTOM XL and UniTOM HR enabled both whole-device scans and high-resolution VOI™ inspections. A 15-inch laptop scan provided system-level context, while VOI scans revealed voids in CPU BGA solder bumps.

In sealed smartwatch batteries, Micro-CT exposed electrode misalignment and irregular anode overhang without disassembly. Microchip analysis combined overview scans with submicron VOI imaging to verify TSV alignment and detect voids inside individual solder bumps.

High-resolution scans of wire bonds captured placement accuracy and packaging defects, confirming connectivity risks. These results show how non-destructive Micro-CT delivers structural clarity and fault detection across devices and components — faster and with greater precision than traditional methods.

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Tescan Instruments & Technology

Used in This Workflow

Tescan UniTOM HR with Submicron Resolution and 4D Dynamic CT 

Tescan UniTOM HR provides submicron resolution and dynamic CT for small samples. It supports both overview and VOI scans in a single workflow, making it ideal for detailed component inspection.

  • High spatial resolution below 600 nm for fine structural detail

  • True 4D dynamic CT with sub-5-second temporal resolution

  • In-situ compatibility with powered devices, pressure setups, and rotational stages

  • Fast overview and VOI scans in a single workflow
MICRO_UniTOM_HR_1-2
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Tescan UniTOM XL with Large-Volume Imaging and In-Situ Compatibility 

Tescan UniTOM XL is built for full-device imaging, handling assemblies up to 45 kg. It combines a large scanning envelope with in-situ compatibility for system-level inspection.

  • Large scanning envelope for devices and assemblies up to 45 kg

  • True 4D dynamic CT with sub-5-second temporal resolution

  • In-situ compatibility with powered devices, pressure setups, and rotational stages

  • Fast, non-destructive imaging of full devices with VOI zooming
MICRO_UniTOM_XL_1-2
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Where can you find us:

Tescan
Libušina třída 21
623 00 Brno 
Czech Republic

info@Tescan.com 

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