Tescan at ISTFA 2025:
Advancing Failure Analysis

FemtoChisel the first system where speed, quality, and correlation converge — accelerating inspection, failure analysis and targeted internal access, lowering cost-per-sample while handling the most heterogeneous materials in todays and tomorrow’s microelectronics. One platform, any sample, pristine results.

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FemtoChisel

Faster. Cleaner. Damage-Free.
Tescan FemtoChisel delivers up to 5× faster prep with debris-free, pristine cross-sections—no heat damage, no FIB rework.

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Monday November 17

10:20–10:40

Lukas presentation ISTFA

Leveraging Automation of TEM Sample Preparation for Increased Throughput and Reproducible Results from Advanced Multimodal STEM Analysis of 3-nm FinFET Transistors

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by Lukáš Hladík

Monday November 17

10:40–11:00

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FIB and STEM Analysis of Protective Coating

Lucille Giannuzzi

by Lucille A. Giannuzzi, Ph.D.

Wednesday November 19

03:00–04:00

Daniel Poster istfa

Microscopy Analysis and Material Characterization - Streamlining Accurate 4D-STEM Phase-Orientation Analysis of Polymorphic Polycrystalline Thin Films in Semiconductor TEM Labs for Routine Application

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by Daniel Němeček, Ph.D.

Join Us at Booth 415

Experience the Next Step in Microscopy

Snímek obrazovky 2025-10-08 141101 (1)

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Booth 415

Pasadena Convention Center
300 East Green Street
Pasadena, California
United States