Ex Situ Lift-Out for Scalable, High-Throughput TEM Specimen Preparation

Tescan EXLO

Name: Tescan EXLO
Brand: Tescan
SKU: EXLO800
Availability: InStock

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Tescan EXLO is designed for laboratories where TEM throughput, reproducibility, and cost efficiency matter. By moving specimen lift-out outside the FIB-SEM, EXLO keeps valuable beam time focused on milling, while parallelizing lamella transfer and grid mounting. The result: higher output, lower cost per specimen, and a more efficient workflow.

High-throughput TEM sample preparation with parallel milling and transfer

Lower cost per specimen through optimized FIB-SEM utilization

Secure and reproducible lamella mounting with EXpressLO™ PGrids

Seamless integration with TEM AutoPrep™, cryo transfer, and multi-system workflows

WHERE Tescan EXLO MAKES THE DIFFERENCE

Throughput without Compromise

Increase the number of TEM lamellae per shift by decoupling milling from manipulation.

Reduced Cost per Specimen

Optimize FIB utilization and let EXLO handle repetitive transfer steps, lowering operational costs.

Ease of Use

Intuitive joystick control, live optical imaging, and semi-automated workflows reduce training time and operator fatigue.

Scalable Investment

One EXLO supports several FIB-SEM systems, increasing efficiency without duplicating resources.

Specimen Integrity

Patented EXpressLO™ PGrids ensure secure placement and reproducible attachment, with options for copper, nickel, and nanocrystalline diamond formats.

Versatile Environments

Compatible with inert gas, vacuum, or cryo transfer, protecting air-sensitive and cryogenic specimens.

Tescan EXLO APPLICATIONS

Tescan EXLO in Semiconductors

High-throughput TEM sample preparation for process control and failure analysis

Parallel lift-out enables continuous FIB milling while lamella transfer happens externally
Scalable solution allows one EXLO to serve multiple FIB-SEMs, reducing per-specimen cost
Compatible with inert gas and cryo transfer to preserve delicate semiconductor structures

Tescan EXLO accelerates semiconductor workflows where specimen demand is high. By decoupling manipulation from FIB usage, engineers can prepare more lamellae per shift without expanding instrument capacity. The system ensures reproducibility across large batches, enabling confident analysis in process development, yield monitoring, and failure diagnostics.

Tescan EXLO in Materials Science

Reliable lift-out for diverse materials and nanostructures

Supports a wide range of grids including copper, nickel, and nanocrystalline diamond formats
Secure lamella mounting in both top-down and inverted configurations for flexible thinning
Reduces risk of FIB-induced damage to beam-sensitive materials by externalizing transfer

For materials scientists, EXLO simplifies the preparation of specimens ranging from thin films to fragile nanostructures. Its precision handling ensures stable transfer and mounting, minimizing artifacts that can affect downstream TEM analysis. With reproducible workflows and optimized grids, EXLO enables consistent results for both fundamental research and applied studies.

Tescan EXLO in Nanotechnology

Precise transfer for delicate specimens

Enables lift-out of nanoparticles, nanowires, and thin films without prolonged FIB exposure
Minimizes structural damage by handling transfers outside the ion beam environment
Preserves cryo and air-sensitive specimens with vacuum or inert gas transfer options

EXLO provides a controlled environment for preparing specimens that are especially vulnerable to beam damage or contamination. By externalizing the transfer step, researchers can protect the integrity of delicate nanostructures and sensitive materials. This extends the lab’s capabilities into advanced nanotechnology research, ensuring high-quality TEM analysis of even the most delicate specimens.

Unlocked content

Tescan TEM AutoPrep™

AUTOMATION THAT INCREASES OUTPUT

Tescan EXLO is designed to work seamlessly with Tescan TEM AutoPrep™ automation. Lamellae can be milled in batches inside the FIB-SEM, while EXLO takes over the transfer step externally. This parallelization increases output and frees the instrument for continuous milling and analytical tasks.

The workstation combines a motorized stage, live optical imaging, and joystick navigation in an intuitive interface that shortens training and ensures reproducibility. Patented EXpressLO™ slotted grids provide stable mounting in copper, nickel, or nanocrystalline diamond formats. For sensitive specimens, EXLO supports vacuum, inert gas, and cryo transfer to maintain integrity during handling.

Common Challenges in High-Resolution Material Analysis

Advanced materials used in energy storage, aerospace, nanotechnology, and biomedical applications require in-depth structural insights. However, traditional imaging techniques often fall short when analyzing multi-phase structures, nanoscale defects, and buried interfaces.

FIB-SEM tomography addresses these challenges by providing:

Sub-nanometer precision in 3D imaging for detailed microstructural analysis.
Site-specific cross-sectioning to study buried features without sample destruction.
Multi-modal integration with EDS and EBSD for correlative material characterization.

Comparison of per sample time between INLO and EXLO.

FIB prepared EXLO specimen via AutoPrep(TM) Pro.

Subset of > 60 EXLO samples manipulated during the M&M 2023 exhibition.

Specimens EXLO manipulated to a slotted Cu half grid ready for low energy polishing.

EXLO specimen manipulated to a DENSsolutions MEMS device.

Low magnification TEM image of yeast cryo EXLO manipulated to a C-Flat grid.

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Tescan EXLO

Technical specification

EXLO 800
	Wafer	up to 200 mm
	Manipulator	Motorized XYZ + manual R, optional 2nd XYZ
	Optical microscope	High-resolution, parfocal zoom
	Grid compatibility	Cu, Ni, NCD slotted grids; standard and inverted lamella
	Optional tools	Aspirato™ hollow glass probe for vacuum-assisted transfer
	Workstation	Integrated computer, joystick, monitor
EXLO 1200
	Wafer	up to 300 mm
	Manipulator	Motorized XYZ + manual R, optional 2nd XYZ
	Optical microscope	High-resolution, parfocal zoom
	Grid compatibility	Cu, Ni, NCD slotted grids; standard and inverted lamella
	Optional tools	Aspirato™ hollow glass probe for vacuum-assisted transfer
	Workstation	Ergonomic workstation with active suspension system

EXLO 800
Wafer	up to 200 mm
Manipulator	Motorized XYZ + manual R, optional 2nd XYZ
Optical microscope	High-resolution, parfocal zoom
Grid compatibility	Cu, Ni, NCD slotted grids; standard and inverted lamella
Optional tools	Aspirato™ hollow glass probe for vacuum-assisted transfer
Workstation	Integrated computer, joystick, monitor
EXLO 1200
Wafer	up to 300 mm
Manipulator	Motorized XYZ + manual R, optional 2nd XYZ
Optical microscope	High-resolution, parfocal zoom
Grid compatibility	Cu, Ni, NCD slotted grids; standard and inverted lamella
Optional tools	Aspirato™ hollow glass probe for vacuum-assisted transfer
Workstation	Ergonomic workstation with active suspension system