Tescan Orage™ 2

Orage™ 2, the new Ga⁺ FIB column, raises speed and consistency in TEM lamella preparation with less operator effort. 

The improved spot profile of Orage™ 2 at high beam currents delivers up to 40% faster milling for TEM lamella preparation, making high-volume work more efficient and reducing the cost per sample. At the same time, clearer low-keV FIB imaging down to 500 eV ensures precise beam placement during the final cleaning step, helping users avoid the “gray-in-gray” effect and giving them full confidence in achieving ultra-thin lamellae. 

With Orage™ 2 at its core, FIB SEM Tescan SOLARIS 2 builds on these advantages to accelerate fully automated lamella preparation by almost half. Automation is driven by the TEM AutoPrep™ Pro software module, which reduces operator effort by managing every step from trench milling and lift-out to the final low-keV clean on the grid. During the lift-out step, Tescan’s OptiLift™ attaches the lamella to the grid in a single, reliable motion. Together, they create a seamless, fully automated workflow for top-down, inverted, and planar geometries, perfectly suited for demanding semiconductor applications such as 3D NAND and FinFETs. 

• Run FIB SEM Tescan SOLARIS 2 overnight and return to finished lamellae in the morning. With TEM AutoPrep™ Pro and OptiLift™, SOLARIS 2 prepares multiple lamellae from different sites in one unattended run. 
  
  

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• SOLARIS 2 delivers ultra-thin TEM lamellae for high-quality TEM analysis, finished with an improved final low-keV cleaning down to 500 eV to minimize amorphous damage and leave clear, high contrast surfaces. 
  
  

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• Designed for failure analysis, quality control engineers, and R&D teams, this solution is built to maximize throughput while delivering reliability needed for fully or semi-automated TEM sample preparation and cross-sectioning.
  
  

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• Optimized for high-volume labs requiring reproducible multi-sample preparation in quality control workflows.