Tescan FemtoChisel™ has been selected as a finalist in the Lasers category of the 2027 SPIE Prism Awards, recognizing its contributions to laser-based sample preparation and semiconductor failure analysis.
Now in its 20th year, the annual SPIE Prism Awards recognize commercialized innovations in photonics, honoring companies that bring advanced optical and photonic technologies to market.
FemtoChisel™ combines femtosecond laser processing, intelligent targeting, and precision sample preparation to address challenges in semiconductor failure analysis and advanced materials characterization.
By enabling access to buried structures and large-area cross-sectioning, FemtoChisel supports more efficient sample preparation and practical engineering workflows that require both speed and precision.
"Being selected among the top three is already a remarkable achievement and an excellent opportunity to reinforce our position as an innovator in the laser technology industry," said Dr. Sina Shahbazmohamadi, Head of Technology at Tescan.
"More importantly, this recognition is a testament to our innovative technology and the passion, hard work, and dedication of the entire laser team."
FemtoChisel's selection as a finalist recognizes the collective efforts of Tescan's laser team and the continued advancement of laser-based technologies designed to address real-world challenges in scientific research and industrial applications.