At SEMICON Taiwan 2025, Tescan’s Global Business Development Director for Semiconductors, Hervé Macé, and APAC Managing Director, Sean Lee, joined DIGITIMES to discuss how workflow integration, automation, and collaboration are shaping the next chapter of semiconductor analysis and advanced packaging.
Hervé explained that Tescan works with semiconductor customers across all stages of development, from R&D and ramp-up to production support and failure analysis. He emphasized that the company’s focus is on building workflow-centric solutions that help customers handle increasingly complex architectures such as 3D ICs, chiplets, and system-on-chip integrations.
“Teams today need to localize issues faster, prepare samples reliably, and deliver data that leads to clear decisions,” Hervé noted. “Our role is not only to provide instrumentation but to remove friction between a question and an insight.”
He highlighted the growing importance of standardized and repeatable workflows. By integrating non-destructive inspection, laser processing, and focused ion beam (FIB) precision into one workflow, Tescan enables semiconductor engineers to move efficiently from defect localization to root cause analysis. This approach supports faster time-to-data and more consistent results across different labs and technology nodes.
Sean Lee also discussed how the company’s expanding presence in Asia supports its semiconductor customers more closely. With new subsidiaries in Taiwan, Singapore, and Korea, and growing operations in China, Tescan is positioning itself to provide faster support, closer collaboration, and consistent enablement for regional partners.
“Customers can expect shorter response times, stronger service networks, and measurable improvements in their daily workflows,” Sean explained. “It is about transforming from an equipment supplier to a technology partner that helps customers achieve the results they need.”
Watch the full DIGITIMES interview with Hervé Macé and Sean Lee to learn more about Tescan’s semiconductor strategy and its vision for smarter, standardized workflows that move from insight to decision faster.
To learn more about Tescan’s semiconductor solutions, visit our Semiconductor Solutions page or contact our regional teams to discuss how integrated workflows can accelerate your next innovation.