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Laser and FIB-SEM Integration: Why femtosecond laser processing is used for rapid access and large-volume material removal, followed by FIB-SEM for final polishing, high-resolution imaging, and analytical characterization. SEMICON Taiwan Forum Preview: Hervé also previews how FemtoChisel™ fits within a broader failure analysis workflow and the application challenges discussed during Tescan’s forum presentation. 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