Discover Tescan Exlo - Our Ex Situ Lift-Out Solution

Discover Tescan Exlo
Our Ex Situ Lift-Out Solution

Tescan EXLO is a high-precision ex situ lift-out system for semiconductor and materials labs aiming to boost throughput, cut TEM costs, and reduce FIB-SEM dependency. By moving specimen manipulation outside the FIB-SEM, EXLO enables parallel processing, lowering costs and increasing prep efficiency. Its intuitive, motorized, semi-automated design delivers fast, reproducible lift-outs while keeping the FIB-SEM free for critical tasks.

Tescan EXLO

Fast, reliable, and scalable
ex situ lift-out for high-volume semiconductor and materials analysis workflows.

Tescan EXLO features a motorized XYZR manipulator, parfocal zoom optics, and intuitive software for semi-automated ex situ workflows. It handles samples up to 50 mm, offers optional upgrades, and supports coordinate import/export. Compatible with multiple FIBs and TEM AutoPrep Pro™, it boosts throughput and cuts specimen costs.

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Key benefits

Reduce the cost per TEM specimen
Maximize FIB-SEM utilization
Increase lab efficiency
Ensure high-quality, reproducible TEM results across high specimen volumes
Assure specimen stability and attachment reliability
Ensure the integrity of air-sensitive and cryo-prepared
specimens

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Explore the tool that helps you get answers

Tescan instruments are built to solve your research challenges - fast.
Let’s find the right solution together.

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Let’s find the right fit for your research

Talk to a Tescan expert about your goals - we’ll help you pinpoint the system and workflow that move your work forward.

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Where can
you find us:

Tescan
Libušina třída 21
623 00 Brno
Czech Republic

info@tescan.com

Fast, reliable, and scalable ex situ lift-out for high-volume semiconductor and materials analysis workflows.